5SGSMD8K3F40C3N

The 5SGSMD8K3F40C3N is a Stratix V GS Field Programmable Gate Array (FPGA) IC designed for high-density, programmable-logic applications. It integrates 695,000 logic elements and approximately 51.2 Mbits of embedded RAM to support complex logic and memory-intensive designs.

With 696 user I/Os, a 1517-FBGA (40×40) package, and a commercial operating temperature range, this surface-mount FPGA targets demanding commercial embedded systems that require high I/O capacity, large on-chip memory, and significant programmable logic resources.

Key Features

• Core density  695,000 logic elements provide substantial programmable logic capacity for large designs and complex algorithms.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM for data buffering, FIFOs, and memory-intensive functions.
• I/O capability  696 user I/O pins accommodate high-pin-count interfaces and dense external connectivity.
• Packaging  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA 40×40) for compact, high-pin-count board integration.
• Power  Core voltage supply range of 820 mV to 880 mV to support the device’s internal power requirements.
• Mounting & grade  Surface-mount device offered in commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards compliance  RoHS compliant.

Typical Applications

• High-density programmable logic designs  Systems that require extensive logic capacity can leverage the 695,000 logic elements for complex state machines and datapath implementations.
• Memory-intensive functions  Designs needing substantial on-chip buffering or embedded memory can use the approximately 51.2 Mbits of RAM for FIFOs, frame buffers, and temporary storage.
• High-pin-count I/O systems  Boards requiring many external interfaces can utilize the 696 I/O pins for parallel buses, multi-lane interfaces, and dense connector requirements.
• Commercial embedded platforms  Surface-mount FCBGA packaging and commercial temperature grading suit embedded systems and commercial electronic products.

Unique Advantages

• High programmable logic capacity: 695,000 logic elements enable large-scale integration of custom logic without external ASICs.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive I/O resources: 696 I/O pins provide flexibility for connecting multiple peripherals, buses, and high-throughput interfaces.
• Compact, high-density package: 1517-FBGA (40×40) allows for a high pin-count footprint in surface-mount form for space-constrained designs.
• Commercial-grade readiness: Operates across a 0 °C to 85 °C range and is RoHS compliant for standard commercial product deployments.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV supports the device’s internal power requirements and system-level power planning.

Why Choose 5SGSMD8K3F40C3N?

The 5SGSMD8K3F40C3N delivers a balance of high logic density, significant embedded RAM, and broad I/O capability in a compact FCBGA package, making it suitable for complex commercial embedded designs that demand on-chip resources. Its specifications support integration of large programmable subsystems while keeping board area and external component count under control.

For teams building scalable, memory- and I/O-intensive FPGA designs, this Stratix V GS device provides the raw resources and packaging options needed for robust, commercially deployed systems, backed by series-level documentation and compliance information.

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