5SGSMD8K3F40C3NCV
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,328 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8K3F40C3NCV – Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA
The 5SGSMD8K3F40C3NCV is a Stratix V GS family Field Programmable Gate Array (FPGA) optimized for high-density logic and memory integration. Built for commercial-grade deployments, this surface-mount FCBGA device delivers large programmable logic capacity, substantial on-chip RAM, and a high I/O count to support complex digital systems.
This device is suited for designs that require extensive embedded memory, broad I/O connectivity, and a compact 1517-ball FCBGA package, while operating within a low-voltage core supply range for power-sensitive FPGA designs.
Key Features
- Logic Capacity 695,000 logic elements provide a large fabric for complex logic implementation and high gate-count designs.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for deep buffering, large LUT-based structures, and memory-intensive algorithms.
- I/O Density 696 I/O pins to support extensive external interfaces and high-pin-count connectivity requirements.
- Package & Mounting 1517-BBGA (FCBGA) package in a 1517-FBGA (40×40) supplier package; surface-mount mounting for compact board-level integration.
- Power Core voltage supply range from 820 mV to 880 mV for low-voltage operation and optimized core power delivery.
- Temperature & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Standards Compliance RoHS-compliant for environmental and regulatory compatibility in commercial products.
Typical Applications
- High-density digital processing Large logic capacity and on-chip RAM enable implementation of complex datapaths and custom processing engines.
- Memory-intensive algorithms Approximately 51.2 Mbits of embedded memory supports buffering, caching, and stateful logic for signal processing and compute tasks.
- High-pin-count interface systems 696 I/Os accommodate multiple parallel interfaces, large sensor arrays, or extensive peripheral connectivity.
Unique Advantages
- Substantial programmable fabric 695,000 logic elements allow designers to consolidate functionality into a single FPGA, reducing component count.
- Large on-chip memory Approximately 51.2 Mbits of RAM minimizes external memory dependency and improves throughput for memory-bound functions.
- High I/O capacity 696 I/Os enable flexible system partitioning and support for numerous external interfaces without additional I/O expanders.
- Compact FCBGA footprint 1517-ball FCBGA packaging supports high-density PCB designs while maintaining robust signal routing options.
- Low-voltage core operation 820–880 mV supply range helps manage core power for energy-conscious FPGA implementations.
- Commercial readiness RoHS compliance and a 0 °C to 85 °C operating range simplify integration into mainstream commercial products.
Why Choose 5SGSMD8K3F40C3NCV?
The 5SGSMD8K3F40C3NCV positions itself as a high-capacity Stratix V GS FPGA option for commercial designs that demand large logic arrays, significant embedded memory, and extensive I/O. Its FCBGA package and surface-mount form factor make it suitable for compact, high-density board layouts where consolidating functionality into a single programmable device is a priority.
Customers designing complex digital systems, memory-heavy processing pipelines, or high-connectivity platforms will find the combination of logic resources, on-chip RAM, and I/O count advantageous for reducing BOM complexity and achieving tighter integration within the Stratix V family architecture.
Request a quote or submit an inquiry to get pricing, availability, and support information for the 5SGSMD8K3F40C3NCV. Technical documentation is available to assist with electrical and switching characteristic details during system design.

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