5SGSMD8K3F40I3G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,162 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8K3F40I3G – Stratix® V GS FPGA, 695,000 logic elements
The 5SGSMD8K3F40I3G is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. This high-density FPGA integrates 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os to support designs that require large programmable logic resources and extensive I/O connectivity.
Designed for industrial-grade applications, the device operates over a core supply voltage range of 820 mV to 880 mV and an ambient temperature range of –40 °C to 100 °C, providing a combination of density, on-chip memory, and environmental tolerance for demanding system designs.
Key Features
- Core Density 695,000 logic elements provide a large programmable fabric for complex logic implementations and high integration of custom functions.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
- I/O Count 696 user I/Os enable dense external connectivity for parallel interfaces, wide buses, and multiple peripherals.
- Power and Voltage Core supply operating range of 820 mV to 880 mV to match system power-architecture requirements.
- Package & Mounting 1517-BBGA (1517-FBGA, 40×40) ball-grid array package with surface-mount mounting type for board-level integration.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-density programmable logic designs Use where large logic capacity is required to implement complex state machines, algorithms, or custom accelerators directly in programmable fabric.
- On-chip memory–heavy designs Systems that benefit from substantial embedded RAM for buffering, packet queues, or lookup storage can leverage approximately 51.2 Mbits of on-chip memory.
- High-pin-count systems Applications needing wide external interfaces, parallel buses, or many peripheral connections can utilize the device’s 696 I/Os.
- Industrial environment systems Deployments requiring operation across a broad temperature range (–40 °C to 100 °C) can take advantage of the device’s industrial grade rating.
Unique Advantages
- Highly integrated logic and memory: A combined offering of 695,000 logic elements and ~51.2 Mbits of on-chip RAM reduces the need for external logic and memory components.
- Extensive external connectivity: 696 I/Os enable flexible board-level interfaces and simplify routing for multi-channel and parallel designs.
- Industrial temperature capability: Rated from –40 °C to 100 °C to support deployments in industrial operating conditions.
- Compact BGA footprint: 1517-FBGA (40×40) ball-grid array package supports high pin density in a surface-mount form factor suitable for compact system boards.
- Low-voltage core compatibility: 820–880 mV core supply range aligns with modern low-voltage power architectures.
- Regulatory alignment: RoHS compliance for environmental and regulatory considerations.
Why Choose 5SGSMD8K3F40I3G?
The 5SGSMD8K3F40I3G offers a high-density Stratix V GS FPGA option for designs that require a large logic fabric, substantial on-chip memory, and extensive I/O capability in an industrial-grade package. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 696 I/Os makes it well suited to complex, integration-focused systems where consolidating functions into a single programmable device reduces board-level complexity.
With a surface-mount 1517-FBGA package, industrial temperature rating, and RoHS compliance, this FPGA is positioned for engineers and procurement teams seeking a robust, high-capacity programmable device backed by Intel’s Stratix V family documentation.
Request a quote or submit a product inquiry to begin procurement or to get additional ordering information and availability for part number 5SGSMD8K3F40I3G.

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