5SGSMD8K3F40I3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 1,162 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8K3F40I3G – Stratix® V GS FPGA, 695,000 logic elements

The 5SGSMD8K3F40I3G is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. This high-density FPGA integrates 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os to support designs that require large programmable logic resources and extensive I/O connectivity.

Designed for industrial-grade applications, the device operates over a core supply voltage range of 820 mV to 880 mV and an ambient temperature range of –40 °C to 100 °C, providing a combination of density, on-chip memory, and environmental tolerance for demanding system designs.

Key Features

  • Core Density  695,000 logic elements provide a large programmable fabric for complex logic implementations and high integration of custom functions.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
  • I/O Count  696 user I/Os enable dense external connectivity for parallel interfaces, wide buses, and multiple peripherals.
  • Power and Voltage  Core supply operating range of 820 mV to 880 mV to match system power-architecture requirements.
  • Package & Mounting  1517-BBGA (1517-FBGA, 40×40) ball-grid array package with surface-mount mounting type for board-level integration.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-density programmable logic designs  Use where large logic capacity is required to implement complex state machines, algorithms, or custom accelerators directly in programmable fabric.
  • On-chip memory–heavy designs  Systems that benefit from substantial embedded RAM for buffering, packet queues, or lookup storage can leverage approximately 51.2 Mbits of on-chip memory.
  • High-pin-count systems  Applications needing wide external interfaces, parallel buses, or many peripheral connections can utilize the device’s 696 I/Os.
  • Industrial environment systems  Deployments requiring operation across a broad temperature range (–40 °C to 100 °C) can take advantage of the device’s industrial grade rating.

Unique Advantages

  • Highly integrated logic and memory:  A combined offering of 695,000 logic elements and ~51.2 Mbits of on-chip RAM reduces the need for external logic and memory components.
  • Extensive external connectivity:  696 I/Os enable flexible board-level interfaces and simplify routing for multi-channel and parallel designs.
  • Industrial temperature capability:  Rated from –40 °C to 100 °C to support deployments in industrial operating conditions.
  • Compact BGA footprint:  1517-FBGA (40×40) ball-grid array package supports high pin density in a surface-mount form factor suitable for compact system boards.
  • Low-voltage core compatibility:  820–880 mV core supply range aligns with modern low-voltage power architectures.
  • Regulatory alignment:  RoHS compliance for environmental and regulatory considerations.

Why Choose 5SGSMD8K3F40I3G?

The 5SGSMD8K3F40I3G offers a high-density Stratix V GS FPGA option for designs that require a large logic fabric, substantial on-chip memory, and extensive I/O capability in an industrial-grade package. Its combination of 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 696 I/Os makes it well suited to complex, integration-focused systems where consolidating functions into a single programmable device reduces board-level complexity.

With a surface-mount 1517-FBGA package, industrial temperature rating, and RoHS compliance, this FPGA is positioned for engineers and procurement teams seeking a robust, high-capacity programmable device backed by Intel’s Stratix V family documentation.

Request a quote or submit a product inquiry to begin procurement or to get additional ordering information and availability for part number 5SGSMD8K3F40I3G.

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