5SGSMD8K3F40I3

The 5SGSMD8K3F40I3 is a Stratix® V GS Field Programmable Gate Array (FPGA) IC from Intel. This device provides 695,000 logic elements, approximately 51.2 Mbits of embedded memory, and a high I/O count of 696 in a surface-mount FCBGA package.

Designed for applications that require large programmable logic capacity and dense external interfacing, the device operates from a core voltage supply of 820 mV to 880 mV and is rated for industrial temperature operation from –40 °C to 100 °C.

Key Features

• Core Logic Capacity  Provides 695,000 logic elements to implement large, complex logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and data processing.
• I/O and Package  696 accessible I/Os in a 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) for high-density board integration.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power domains.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C.
• Mounting  Surface-mount package suitable for automated PCB assembly.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Use the large logic capacity and embedded memory to consolidate multiple functions into a single FPGA.
• Multi-interface aggregation  Leverage the 696 I/Os and flexible packaging for designs that require many external connections and protocol interfacing.
• Industrial control and automation  Industrial temperature rating (–40 °C to 100 °C) makes the device suitable for robust factory and field equipment designs.

Unique Advantages

• Large programmable fabric: 695,000 logic elements enable implementation of complex algorithms and feature-rich systems on a single device.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports buffering, temporary data storage, and state machines without external memory in many use cases.
• High I/O density: 696 I/Os in a compact 1517-BBGA package simplify system partitioning and reduce the need for external interface chips.
• Industrial temperature range: Rated from –40 °C to 100 °C to meet the environmental requirements of industrial applications.
• Compact surface-mount package: FCBGA 1517 form factor supports automated assembly and space-constrained board layouts.
• Regulatory compliance: RoHS compliant to support environmental requirements.

Why Choose 5SGSMD8K3F40I3?

The 5SGSMD8K3F40I3 combines large logic capacity, substantial on-chip memory, and a high I/O count in a robust industrial-grade FCBGA package. As a member of the Stratix V family from Intel, it is positioned for designs that demand dense programmable logic, extensive interfacing, and reliable operation across a wide temperature range.

This part is suited for engineering teams building complex embedded systems, communication interfaces, and industrial automation equipment where consolidation of functions and high I/O density reduce board-level complexity.

Request a quote or submit an inquiry to check pricing and availability for the 5SGSMD8K3F40I3. Our team can provide lead-time and ordering information to support your design schedule.