5SGSMD8K3F40I3L

The 5SGSMD8K3F40I3L is an industrial‑grade Stratix® V GS Field Programmable Gate Array (FPGA) in a 1517‑BBGA FCBGA package. It provides large on‑chip logic capacity and extensive I/O for designs that require significant programmable resources and dense board integration.

Designed for use where high logic density, substantial embedded memory, and broad I/O counts are required, this device targets systems needing scalable programmable logic and robust operating range.

Key Features

• Core & logic capacity — 695,000 logic element cells, delivering substantial programmable logic resources for complex designs.
• Embedded memory — 51,200,000 total RAM bits, approximately 51 Mbits of embedded memory for buffering, caching, and on‑chip data storage.
• I/O density — 696 user I/O pins, enabling broad peripheral connectivity and high‑pin‑count interfaces.
• Power — Core voltage supply range specified at 820 mV to 880 mV to match system power-rail requirements.
• Package & mounting — 1517‑BBGA FCBGA (supplier package 1517‑FBGA 40×40), surface‑mount format suitable for compact, high‑density board layouts.
• Temperature grade — Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
• RoHS compliance — Device is RoHS compliant for environmental regulatory considerations.

Typical Applications

• High‑density programmable systems — Use where large logic element counts and on‑chip RAM are required to implement complex custom logic and datapaths.
• I/O‑intensive designs — Suitable for systems that require many external interfaces or high pin counts, enabled by 696 available I/O pins.
• Industrial and embedded platforms — Industrial temperature rating and surface‑mount packaging make it suitable for embedded systems operating across wide temperature ranges.
• Prototyping and development — Large logic and memory resources support advanced prototyping of compute‑heavy designs that will scale to production hardware.

Unique Advantages

• Large programmable capacity: 695,000 logic element cells provide headroom to implement complex algorithms and large state machines on a single device.
• Significant on‑chip memory: Approximately 51 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑storage tasks.
• Extensive I/O availability: 696 I/O pins allow flexible interfacing with multiple peripherals and high‑pin‑count connectors without external multiplexing.
• Industrial temperature operation: Rated for −40 °C to 100 °C to support deployments in temperature‑challenging environments.
• Compact, surface‑mount package: 1517‑BBGA (40×40 supplier package) enables dense board-level integration while maintaining thermal and mechanical suitability for industrial applications.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGSMD8K3F40I3L?

The 5SGSMD8K3F40I3L combines very large logic capacity and substantial embedded RAM with a high I/O count in an industrial‑grade Stratix V GS FPGA. Its package and surface‑mount form factor are intended for space‑constrained, high‑density boards, while the specified core voltage range and wide operating temperature support integration into a variety of industrial and embedded systems.

This device is suited to teams and designs that need scalable programmable resources, significant on‑chip memory, and broad external connectivity—providing a platform-level FPGA that supports complex, I/O‑heavy implementations with industrial operating margins.

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