5SGSMD8K3F40I3NCV

The 5SGSMD8K3F40I3NCV is an Intel Stratix® V GS field programmable gate array (FPGA) offered in an industrial temperature grade. It integrates a high-density programmable logic fabric with a large on-chip memory footprint and extensive I/O capability.

With approximately 695,000 logic elements, roughly 51.2 Mbits of embedded memory, and up to 696 I/Os, this device is designed for applications that require high logic capacity, significant embedded RAM, and broad external connectivity while operating at an 820 mV to 880 mV core supply and an industrial temperature range.

Key Features

• High Logic Density  Approximately 695,000 logic elements to implement complex digital functions and large-scale custom logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and memory-intensive datapaths.
• Large I/O Count  Up to 696 I/Os to support broad external interfacing and dense board-level connectivity.
• Low-Voltage Core  Core voltage range of 820 mV to 880 mV for compatibility with low-voltage power domains.
• Industrial Temperature Grade  Specified to operate from –40 °C to 100 °C for demanding environmental conditions.
• Package and Mounting  1517-BBGA FCBGA package (supplier device package 1517-FBGA, 40×40) with surface-mount mounting for compact, high-density PCB designs.
• RoHS Compliant  Device meets RoHS requirements for restricted substances.

Typical Applications

• Complex digital systems  Implement large custom logic functions and hardware accelerators using the device’s approximately 695,000 logic elements and abundant embedded RAM.
• High-density I/O aggregation  Systems that require extensive external connectivity can leverage the device’s up to 696 I/Os for parallel interfaces and multi-channel signaling.
• Memory-intensive datapaths  Designs needing substantial on-chip storage can use approximately 51.2 Mbits of embedded memory for buffering, FIFOs, and local data storage.

Unique Advantages

• High integration density: The combination of roughly 695,000 logic elements and significant embedded RAM reduces the need for external logic and memory components.
• Extensive external connectivity: Up to 696 I/Os simplify board-level routing for systems with multiple interfaces and peripherals.
• Industrial temperature range: Rated from –40 °C to 100 °C for deployment in temperature-demanding environments.
• Low-voltage core operation: Core supply between 820 mV and 880 mV aligns with modern low-voltage power architectures.
• Compact surface-mount package: 1517-BBGA FCBGA (1517-FBGA, 40×40) supports high-density PCB implementations while maintaining a standard BGA form factor.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose 5SGSMD8K3F40I3NCV?

The 5SGSMD8K3F40I3NCV delivers a high-density Stratix V GS FPGA option for designs that require substantial logic resources, large embedded memory, and wide I/O capability within an industrial temperature envelope. Its low-voltage core and compact FCBGA package make it suitable for space-constrained boards that still demand significant programmable logic capacity.

This device is well suited for engineering teams building complex, memory- and I/O-intensive systems that need a scalable, high-capacity FPGA with a defined industrial operating range and RoHS compliance.

Request a quote or submit a product inquiry to discuss availability, pricing, and support for integrating 5SGSMD8K3F40I3NCV into your design.