5SGSMD8N1F45C2LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,533 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N1F45C2LG – Stratix® V GS FPGA IC, 695,000 logic elements

The 5SGSMD8N1F45C2LG is a Stratix V GS Field Programmable Gate Array (FPGA) IC from Intel. It provides a large programmable fabric with high on-chip memory and a substantial I/O count for complex digital designs.

This device integrates 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/O pins in a 1932-BBGA FCBGA package. It is a commercial-grade, surface-mount device with a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic Capacity  695,000 logic elements (cells) for implementing large-scale digital logic and custom accelerators.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive logic functions.
  • I/O Density  840 I/O pins to support extensive external interfacing and parallel connectivity.
  • Power / Core Voltage  Core voltage supply range of 820 mV to 880 mV, enabling defined power architecture planning.
  • Package & Mounting  1932-BBGA, FCBGA (supplier device package: 1932-FBGA, FC (45×45)), surface-mount package suitable for high-pin-count implementations.
  • Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • Large programmable fabric: The 695,000 logic elements enable integration of complex logic, multiple processing pipelines, and large custom functions on a single device.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for many designs, simplifying board-level architecture.
  • High I/O count: 840 I/Os provide broad connectivity for multi-channel interfaces, parallel sensors, and wide data buses.
  • High-density package: The 1932-BBGA (1932-FBGA, 45×45) package delivers a high pin count in a compact footprint for designs constrained by PCB area.
  • Defined power rails: A specified core supply window of 820 mV to 880 mV helps with predictable power-system design and voltage sequencing.
  • Commercial deployment: Commercial temperature grading and RoHS compliance align the device with general-purpose electronics and production requirements.

Why Choose 5SGSMD8N1F45C2LG?

The 5SGSMD8N1F45C2LG brings together a high logic capacity, significant embedded memory, and a large I/O complement in a single Stratix V GS FPGA package. These attributes make it suitable for designers who need high-density programmable logic and on-chip resources while maintaining clear power and thermal targets.

Backed by the Stratix V device documentation from Intel, the part is positioned for customers building complex digital systems that require scalable logic, plentiful on-chip RAM, and extensive external interfacing in a surface-mount 1932-BBGA footprint.

Request a quote or submit an inquiry for pricing and availability of the 5SGSMD8N1F45C2LG to begin evaluating this Stratix V GS FPGA for your project requirements.

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