5SGSMD8N1F45C2N

The 5SGSMD8N1F45C2N is an Intel Stratix® V GS field-programmable gate array (FPGA) supplied in a 1932-ball FCBGA package. It delivers a high count of logic resources, abundant on-chip memory, and a large I/O complement for complex, high-density programmable-logic designs.

Offered in a commercial temperature grade with surface-mount packaging, this device is intended for applications that require extensive logic capacity, high I/O integration, and substantial embedded RAM within a compact BGA footprint.

Key Features

• Core Logic  Approximately 695,000 logic elements (cells) to implement large, complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
• I/O Capacity  840 user I/O pins suitable for high-pin-count interfaces and dense board-level integration.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device for standard PCB assembly.
• Power  Core voltage supply range 870 mV to 930 mV to match system power-rail planning and sequencing requirements.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and environmental conformity.

Typical Applications

• High-density digital processing  Implement complex logic, datapath, and DSP pipelines using the device’s large logic and memory resources.
• High-pin-count system interfaces  Integrate multiple parallel and serial interfaces or board-level interconnects using 840 I/Os.
• Embedded system prototyping  Develop and validate large-scale programmable-logic designs requiring significant on-chip RAM and logic capacity.
• Custom accelerators and compute engines  Map specialized compute blocks and buffers into the abundant logic fabric and embedded memory.

Unique Advantages

• Extensive logic resources: Approximately 695,000 logic elements enable large designs without splitting across multiple devices.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching needs.
• High I/O density: 840 I/Os simplify board-level integration for systems that require many external signals or interfaces.
• Compact BGA packaging: 1932-ball FCBGA package provides a high pin-count solution in a compact 45×45 mm footprint for space-constrained boards.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, matching typical commercial electronics environments and deployments.
• RoHS compliant: Conforms to environmental regulations for lead-free manufacturing requirements.

Why Choose 5SGSMD8N1F45C2N?

The 5SGSMD8N1F45C2N combines large logic capacity, substantial embedded memory, and a very high I/O count in a 1932-ball FCBGA package, making it a strong choice for designers who need to consolidate complex digital functions into a single FPGA. Its commercial temperature rating and defined core voltage range allow predictable system-level power and thermal planning.

This device is suited to teams building dense programmable-logic systems, hardware accelerators, or prototypes that require significant on-chip resources and high connector densities while remaining compliant with RoHS requirements.

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