5SGSMD8N1F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 519 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N1F45C2LN – Stratix® V GS Field Programmable Gate Array (FPGA), 1932‑BBGA FCBGA

The 5SGSMD8N1F45C2LN is an Intel Stratix V GS Field Programmable Gate Array supplied in a 1932‑BBGA FCBGA (45×45) surface‑mount package. This commercial‑grade FPGA combines large logic capacity, substantial on‑chip memory, and a high I/O count for complex digital designs and system integration.

Engineered for designs that require dense programmable logic, extensive I/O connectivity, and low‑voltage core operation, this device suits high‑density FPGA implementations across communications, compute, and processing applications.

Key Features

  • Core Architecture Stratix V GS FPGA architecture in a commercial‑grade device offering programmable logic for complex system designs.
  • Logic Capacity 695,000 logic elements to implement large-scale digital functions and custom logic blocks.
  • Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for buffering, look‑up tables, and data‑intensive processing.
  • I/O Resources 840 user I/O pins to support extensive peripheral, board, and subsystem connectivity.
  • Power and Core Voltage Core supply voltage range from 820 mV to 880 mV to match low‑voltage system domains.
  • Package and Mounting 1932‑BBGA, FCBGA package (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor for compact, high‑density boards.
  • Operating Temperature Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Compliance RoHS compliant for regulatory and manufacturing consistency.

Typical Applications

  • Network and Communications Equipment Use the device’s large logic capacity and high I/O count to implement packet processing, protocol bridging, and custom interface logic.
  • High‑Density Signal Processing Leverage approximately 51.2 Mbits of embedded memory and abundant logic for FPGA‑based DSP, filtering, and real‑time data manipulation.
  • Compute Acceleration and Custom Hardware Deploy the Stratix V GS for custom accelerators and offload engines where substantial on‑chip resources and many I/Os are required.
  • Prototyping and System Integration Ideal for complex prototypes and board‑level integration tasks that need a large programmable fabric and extensive peripheral connections.

Unique Advantages

  • Large programmable fabric: 695,000 logic elements enable implementation of complex state machines, datapaths, and custom accelerators without external logic.
  • Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering, local storage, and memory‑centric algorithms.
  • High I/O count: 840 I/Os simplify board routing by bringing many signals directly to the device, reducing external glue logic.
  • Low‑voltage core support: 820–880 mV supply range allows integration with low‑power system rails and core domains.
  • Compact, high‑density package: 1932‑BBGA (45×45) FCBGA package supports dense PCB layouts while maintaining a large resource set.
  • Commercial temperature grading: Rated 0 °C to 85 °C for mainstream commercial deployments and controlled‑environment systems.

Why Choose 5SGSMD8N1F45C2LN?

The 5SGSMD8N1F45C2LN positions itself as a high‑capacity Stratix V GS FPGA offering a combination of extensive logic resources, sizable embedded memory, and a generous I/O complement in a compact FCBGA package. Its low‑voltage core operation and commercial temperature rating make it suitable for demanding board‑level designs where density and integration are key.

This device is well suited for engineering teams building complex communication, processing, or acceleration solutions that require scalable logic, on‑chip memory, and broad connectivity, while maintaining RoHS compliance and a compact footprint.

Request a quote or submit an inquiry to get pricing, availability, and support information for 5SGSMD8N1F45C2LN.

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