5SGSMD8N1F45I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,498 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262400 | Number of Logic Elements/Cells | 695000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGSMD8N1F45I2G – Stratix® V GS Field Programmable Gate Array (FPGA) IC, 695000 logic elements, approximately 51.2 Mbits RAM, 840 I/O, 1932-BBGA
The 5SGSMD8N1F45I2G is a Stratix V GS family FPGA offering a high-density programmable fabric and extensive I/O in a 1932-ball FCBGA package. It provides approximately 695,000 logic elements and approximately 51.2 Mbits of embedded memory, with up to 840 I/O pins, making it suitable for complex, I/O‑heavy and memory‑intensive industrial designs.
Designed for industrial temperature operation, this device combines large logic and memory resources with a low-voltage core supply range to support robust embedded and system-level implementations where high integration and deterministic hardware control are required.
Key Features
- Core Logic Approximately 695,000 logic elements for large-scale programmable logic integration and complex custom logic implementations.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
- I/O Density Up to 840 user I/O pins to support wide parallel interfaces, multiple peripherals, and dense connectivity requirements.
- Package & Mounting 1932-BBGA (supplier package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for high-density PCB integration.
- Power & Voltage Core supply range specified at 870 mV to 930 mV to match low-voltage system power architectures.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant.
Typical Applications
- High‑density signal processing Large logic capacity and substantial on-chip RAM enable implementation of complex DSP pipelines, custom accelerators, and real‑time processing blocks.
- I/O‑intensive systems With up to 840 I/Os, the device supports multi‑lane interfaces, wide parallel buses, and aggregation of numerous peripherals or sensors.
- Industrial control and automation Industrial temperature rating and high integration make it suitable for deterministic control, motor drives, and machine vision preprocessing in industrial applications.
- System-level integration Combines large programmable fabric and embedded memory to reduce external component count in complex embedded systems and prototyping platforms.
Unique Advantages
- High logic density: Large logic element count enables consolidation of multiple functions onto a single device, reducing board-level complexity.
- Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports local buffering and state storage, lowering external memory dependence.
- Extensive I/O bandwidth: Up to 840 I/Os provide flexibility for multi-interface designs and high port counts without additional bridging chips.
- Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for deployment in temperature-challenging environments.
- Low-voltage core: Core supply specified between 870 mV and 930 mV to align with modern low-voltage system rails.
- Surface-mount FCBGA packaging: 1932-ball FCBGA (45 × 45 mm profile) supports compact, high-density board layouts.
Why Choose 5SGSMD8N1F45I2G?
The 5SGSMD8N1F45I2G positions itself as a high‑capacity, industrial‑grade FPGA option within the Stratix V GS family, delivering a combination of large programmable logic, significant on‑chip memory, and extensive I/O in a single surface‑mount FCBGA package. These attributes make it suitable for engineers designing complex, I/O‑heavy systems that require integrated memory and deterministic hardware control across a broad temperature range.
For projects that require consolidation of multiple functions, high parallel connectivity, and industrial temperature robustness, this device offers a scalable platform with clear, verifiable specifications for logic, memory, I/O, power, and packaging.
Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the 5SGSMD8N1F45I2G.

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