5SGSMD8N1F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 51200000 695000 1932-BBGA, FCBGA

Quantity 1,498 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8N1F45I2G – Stratix® V GS Field Programmable Gate Array (FPGA) IC, 695000 logic elements, approximately 51.2 Mbits RAM, 840 I/O, 1932-BBGA

The 5SGSMD8N1F45I2G is a Stratix V GS family FPGA offering a high-density programmable fabric and extensive I/O in a 1932-ball FCBGA package. It provides approximately 695,000 logic elements and approximately 51.2 Mbits of embedded memory, with up to 840 I/O pins, making it suitable for complex, I/O‑heavy and memory‑intensive industrial designs.

Designed for industrial temperature operation, this device combines large logic and memory resources with a low-voltage core supply range to support robust embedded and system-level implementations where high integration and deterministic hardware control are required.

Key Features

  • Core Logic  Approximately 695,000 logic elements for large-scale programmable logic integration and complex custom logic implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory for many functions.
  • I/O Density  Up to 840 user I/O pins to support wide parallel interfaces, multiple peripherals, and dense connectivity requirements.
  • Package & Mounting  1932-BBGA (supplier package: 1932-FBGA, FC, 45×45) in a surface-mount form factor for high-density PCB integration.
  • Power & Voltage  Core supply range specified at 870 mV to 930 mV to match low-voltage system power architectures.
  • Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑density signal processing  Large logic capacity and substantial on-chip RAM enable implementation of complex DSP pipelines, custom accelerators, and real‑time processing blocks.
  • I/O‑intensive systems  With up to 840 I/Os, the device supports multi‑lane interfaces, wide parallel buses, and aggregation of numerous peripherals or sensors.
  • Industrial control and automation  Industrial temperature rating and high integration make it suitable for deterministic control, motor drives, and machine vision preprocessing in industrial applications.
  • System-level integration  Combines large programmable fabric and embedded memory to reduce external component count in complex embedded systems and prototyping platforms.

Unique Advantages

  • High logic density: Large logic element count enables consolidation of multiple functions onto a single device, reducing board-level complexity.
  • Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports local buffering and state storage, lowering external memory dependence.
  • Extensive I/O bandwidth: Up to 840 I/Os provide flexibility for multi-interface designs and high port counts without additional bridging chips.
  • Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for deployment in temperature-challenging environments.
  • Low-voltage core: Core supply specified between 870 mV and 930 mV to align with modern low-voltage system rails.
  • Surface-mount FCBGA packaging: 1932-ball FCBGA (45 × 45 mm profile) supports compact, high-density board layouts.

Why Choose 5SGSMD8N1F45I2G?

The 5SGSMD8N1F45I2G positions itself as a high‑capacity, industrial‑grade FPGA option within the Stratix V GS family, delivering a combination of large programmable logic, significant on‑chip memory, and extensive I/O in a single surface‑mount FCBGA package. These attributes make it suitable for engineers designing complex, I/O‑heavy systems that require integrated memory and deterministic hardware control across a broad temperature range.

For projects that require consolidation of multiple functions, high parallel connectivity, and industrial temperature robustness, this device offers a scalable platform with clear, verifiable specifications for logic, memory, I/O, power, and packaging.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the 5SGSMD8N1F45I2G.

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