5SGSMD8K3F40I3LN

The 5SGSMD8K3F40I3LN is a Stratix V GS Field Programmable Gate Array (FPGA) from Intel, delivered in a 1517-ball FCBGA package optimized for surface-mount applications. It provides very large programmable logic capacity and extensive I/O capability for industrial-temperature designs.

With approximately 695,000 logic elements, around 51.2 Mbits of embedded memory, and 696 device I/Os, this device targets designs that require high-density programmable logic, substantial on-chip RAM, and broad external connectivity while operating across an industrial temperature range.

Key Features

• High Logic Capacity — Approximately 695,000 logic elements to implement large-scale digital designs and complex algorithms on a single device.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, large state machines, and data processing without immediate external memory dependence.
• Extensive I/O — 696 available I/Os to support multiple parallel interfaces, board-level connectivity, and dense peripheral integration.
• Power Supply — Core voltage operating range of 820 mV to 880 mV, enabling designs that follow the device’s specified core power envelope.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for reliable performance in industrial environments.
• Package & Mounting — Supplied in a 1517-BBGA (FCBGA) / 1517-FBGA (40×40) package; surface-mount mounting type for standard PCB assembly flows.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the device’s large logic element count and embedded memory to consolidate complex digital functions onto a single FPGA.
• Networking and communications infrastructure — Leverage the high I/O count to interface with multiple high-speed links and board-level peripherals.
• Industrial control and automation — Industrial temperature rating and extensive I/O make it suitable for control systems, data acquisition, and real-time processing in industrial environments.
• Signal processing and instrumentation — Large on-chip RAM and logic resources support streaming data processing, buffering, and custom pipelines.

Unique Advantages

• Massive programmable capacity: Approximately 695,000 logic elements enable integration of complex functions and consolidation of multiple discrete components.
• Substantial embedded memory: Around 51.2 Mbits of on-chip RAM reduces dependency on external memory and lowers system-level latency for many workloads.
• High I/O density: 696 I/Os give designers flexibility to connect numerous peripherals, interfaces, and multi-lane links directly to the FPGA.
• Industrial temperature support: Specified operation from –40 °C to 100 °C for deployment in temperature-challenging industrial applications.
• Standard FCBGA package: 1517-ball FCBGA (40×40) format supports surface-mount assembly and compact board layouts.
• Environmentally compliant: RoHS compliance for regulated manufacturing requirements.

Why Choose 5SGSMD8K3F40I3LN?

The 5SGSMD8K3F40I3LN combines very large programmable logic capacity, significant on-chip memory, and a high count of device I/Os in a compact FCBGA package rated for industrial temperatures. It is suited to engineering teams looking to implement complex digital systems, high-bandwidth interfacing, and memory-intensive processing within a single FPGA footprint.

Engineered for long-term deployment in industrial environments, the device offers a balance of integration and robustness while simplifying system design through its high density of logic and I/O resources.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and additional technical support for the 5SGSMD8K3F40I3LN.