5SGSMD8K3F40I3N

The 5SGSMD8K3F40I3N is a Stratix® V GS field programmable gate array (FPGA) IC from Intel (Altera). It delivers a high-density programmable fabric with 695,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 user I/Os for complex digital designs.

Built for industrial-grade applications, this device is offered in a surface-mount 1517-BBGA FCBGA package (supplier package 1517-FBGA, 40×40), supports a core voltage range of 820 mV to 880 mV, and operates from −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core Logic 695,000 logic elements to implement large-scale digital designs and system-level integrations.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Capacity 696 user I/O pins to accommodate high pin-count interfaces and dense connectivity requirements.
• Package & Mounting Surface-mount 1517-BBGA FCBGA package (supplier: 1517-FBGA, 40×40) suited to board-level integration with fine-pitch BGA routing.
• Power Core voltage supply defined between 820 mV and 880 mV for the device core power domain.
• Temperature & Grade Industrial grade operation with specified temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density digital processing — Leverage the large logic element count and substantial embedded memory for complex DSP, frame processing, or compute-accelerator designs.
• Telecommunications and networking — High I/O count and programmable fabric enable protocol handling, packet processing, and interface consolidation on a single device.
• Industrial control and automation — Industrial temperature grade and extensive I/O make the device suitable for factory automation controllers and process control systems.
• Board-level system integration — Compact FCBGA packaging and high I/O density support integration into space-constrained, high-performance boards.

Unique Advantages

• High logic capacity: 695,000 logic elements enable implementation of large state machines, datapaths, and system-level functions without partitioning across multiple devices.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data-path operations.
• Extensive connectivity: 696 I/Os provide flexibility to interface with numerous peripherals, high-speed links, and board-level buses.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in harsh or outdoor environments.
• Compact BGA package: 1517-BBGA (1517-FBGA, 40×40) enables dense board layouts while maintaining robust mechanical mounting.
• Regulatory compliance: RoHS compliance supports use in regulated production environments.

Why Choose 5SGSMD8K3F40I3N?

The 5SGSMD8K3F40I3N positions itself as a high-density, industrial-grade member of the Stratix V GS family, combining a large logic fabric, substantial on-chip memory, and extensive I/O in a compact FCBGA package. These characteristics make it appropriate for designs that require consolidation of complex functions, heavy buffering, and broad peripheral connectivity.

Engineers and procurement teams seeking an FPGA with defined core voltage operating window, industrial temperature capability, and RoHS compliance will find this device aligns with demanding board-level and system-level requirements while remaining within the Stratix V device family ecosystem.

Request a quote or contact sales to obtain pricing, availability, and lead-time information for 5SGSMD8K3F40I3N.