5SGSMD8K3F40I3LG

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 51200000 695000 1517-BBGA, FCBGA

Quantity 1,888 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262400Number of Logic Elements/Cells695000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGSMD8K3F40I3LG – Stratix® V GS FPGA, 695,000 logic elements, ~51.2 Mbits RAM, 1517-FBGA

The 5SGSMD8K3F40I3LG is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 1517-FBGA surface-mount package. This industrial-grade device combines large programmable logic capacity with substantial on-chip memory and extensive I/O to support complex, high-density FPGA designs.

Built on the Stratix V family architecture, the device targets applications that require significant logic resources, abundant embedded RAM, and a wide I/O count while operating across an extended industrial temperature range.

Key Features

  • Logic Capacity — 695,000 logic elements to implement large-scale digital designs and custom hardware accelerators.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, packet storage, and multi-port memory implementations.
  • I/O Density — 696 user I/Os to support broad peripheral and high-pin-count interface requirements.
  • Power Supply — Core voltage supply range from 820 mV to 880 mV, enabling precise power budgeting and design integration.
  • Package and Mounting — 1517-BBGA / 1517-FBGA (40×40) FCBGA package supplied for surface-mount PCB assembly.
  • Industrial Grade — Rated for industrial-grade operation with an operating temperature range of −40 °C to 100 °C.
  • Device Family Characteristics — Part of the Stratix V family; series documentation notes available commercial and industrial speed grades and transceiver capability across the Stratix V GX and GS families.
  • RoHS Compliant — Device meets RoHS requirements for lead-free assembly.

Typical Applications

  • High-density logic implementations — Use the large logic element count and embedded RAM to consolidate multiple functions or accelerators into a single FPGA.
  • Industrial control and automation — Industrial-grade temperature rating and robust I/O count support demanding factory and process-control systems.
  • High-throughput data buffering — Significant on-chip RAM enables packet buffering, FIFO implementations, and intermediate data storage for streaming applications.

Unique Advantages

  • Substantial programmable capacity — 695,000 logic elements provide the headroom to implement complex state machines, DSP pipelines, and custom logic functions without partitioning across devices.
  • Large embedded memory — Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks, simplifying board design.
  • High I/O count — 696 user I/Os allow direct interfacing to many peripherals and high-pin-count subsystems, minimizing multiplexing complexity.
  • Industrial temperature range — Rated from −40 °C to 100 °C for deployments in temperature-challenging environments.
  • Standard surface-mount FBGA package — The 1517-FBGA (40×40) package supports compact PCB layouts and automated assembly processes.
  • RoHS compliance — Facilitates lead-free assembly and regulatory alignment for many manufacturing processes.

Why Choose 5SGSMD8K3F40I3LG?

The 5SGSMD8K3F40I3LG positions itself as a high-capacity Stratix V GS FPGA for designs that require a combination of extensive logic resources, significant on-chip RAM, and a large number of I/Os within an industrial temperature envelope. Its package and power specifications support compact, surface-mount implementations while the device’s family-level documentation notes the availability of transceiver and speed-grade options suitable for demanding system designs.

This part is well suited for engineers and teams consolidating complex digital functions into a single FPGA, implementing large buffering and acceleration tasks, or deploying designs into industrial environments where operating temperature and RoHS compliance are important considerations.

Request a quote or submit an inquiry to obtain availability, pricing, and further technical support for the 5SGSMD8K3F40I3LG.

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