5SGSMD8K3F40C3G

The 5SGSMD8K3F40C3G is a Stratix V GS Field Programmable Gate Array (FPGA) IC from Intel, packaged in a 1517-BBGA FCBGA (1517-FBGA, 40×40) surface-mount package. It provides a large logic fabric and extensive I/O for designs that require significant on-chip resources and dense connectivity.

With 695,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 696 I/O pins, this commercial-grade FPGA is targeted at applications that need high integration of logic and memory within a compact BGA footprint while operating within a commercial temperature range.

Key Features

• Core Logic Capacity  695,000 logic elements to support complex digital designs and large-scale HDL implementations.
• Logic Array Blocks  Design capacity reported as 262,400 LABs/CLBs for mapping hierarchical logic structures.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
• I/O Density  696 I/O pins to accommodate wide parallel buses, multiple interfaces, and board-level connectivity.
• Power Supply  Supported core voltage supply range of 820 mV to 880 mV for integration with low-voltage power domains.
• Package & Mounting  1517-BBGA, FCBGA (supplier device package: 1517-FBGA 40×40) in a surface-mount BGA package for high-density PCB designs.
• Temperature & Grade  Commercial grade, rated for operation from 0°C to 85°C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Datacom and Networking  Large logic capacity and high I/O count enable packet processing, protocol bridging, and complex interface aggregation.
• High-Density Embedded Processing  On-chip RAM and abundant logic elements support custom accelerators, signal processing pipelines, and embedded system controllers.
• Industrial Control and Automation (Commercial)  Use in commercial-temperature automation equipment requiring extensive I/O and programmable logic for control and sequencing.
• Prototyping and System Integration  Compact BGA package and surface-mount mounting suit evaluation boards and dense PCB designs for system-level prototyping.

Unique Advantages

• High Logic Density: 695,000 logic elements provide the capacity to implement complex state machines, pipelines, and large custom processors on a single device.
• Substantial Embedded Memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O Resources: 696 I/O pins allow direct interfacing to multiple peripherals, wide buses, and parallel data paths without extensive external multiplexing.
• Compact BGA Footprint: 1517-BBGA (1517-FBGA 40×40) package balances high device density with a board-friendly surface-mount profile.
• Low-Voltage Core Support: 820 mV–880 mV core supply range supports integration with modern low-voltage power architectures.
• Commercial Temperature Rating: Rated 0°C–85°C for deployment in commercial-environment systems.

Why Choose 5SGSMD8K3F40C3G?

The 5SGSMD8K3F40C3G combines a large logic fabric, substantial on-chip memory, and nearly 700 I/O pins in a compact BGA package, making it well suited to designs that demand high integration of logic and connectivity within commercial-temperature systems. Its low-voltage core range and RoHS compliance support modern board-level power and regulatory requirements.

This Stratix V GS FPGA is appropriate for engineering teams building feature-rich, compute- and I/O-intensive systems who require a proven device architecture and detailed device documentation for system implementation and validation.

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