5SGXEA5K2F40C2L

The 5SGXEA5K2F40C2L is a high‑density Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It combines a large programmable logic fabric with substantial on‑chip memory and an extensive I/O count in a 1517‑FBGA (40×40) package for surface‑mount applications.

This device is targeted at designs that require high logic capacity, significant embedded memory, and broad I/O connectivity while operating in commercial temperature environments. Core supply voltage, package, and operating temperature specifications are provided for predictable integration into system designs.

Key Features

• Logic Capacity — 490,000 logic elements to implement large, complex programmable logic designs.
• Embedded Memory — Approximately 46 Mbits of on‑chip RAM for buffering, lookup tables, and data storage within designs.
• I/O Resources — 696 I/O pins to support extensive external interfacing and peripheral connectivity.
• Package & Mounting — 1517‑BBGA FCBGA package (supplier package: 1517‑FBGA, 40×40) with surface‑mount mounting type for compact board layouts.
• Power — Core voltage supply range of 0.820 V to 0.880 V for defined power planning and sequencing.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards & Compliance — RoHS compliant.
• Device Family Capabilities — As a Stratix V GX device, the family includes defined transceiver and core speed grade options and detailed electrical and switching characteristics in the device datasheet.

Typical Applications

• High‑density digital systems — Implement complex logic functions and custom datapaths using the device’s large logic element count.
• Memory‑intensive designs — Leverage approximately 46 Mbits of embedded RAM for buffering, packet storage, and scratchpad memory.
• High‑I/O connectivity — Use 696 I/Os for multi‑lane interfaces, wide parallel buses, or dense sensor and peripheral integration.

Unique Advantages

• Large programmable fabric — 490,000 logic elements enable implementation of sizeable custom logic, helping consolidate functions into a single device.
• Significant on‑chip memory — Approximately 46 Mbits of embedded RAM reduces external memory dependency and simplifies board design.
• Extensive I/O — 696 I/Os provide flexibility for complex interconnect topologies and high pin‑count interfaces.
• Compact board footprint — 1517‑FBGA (40×40) packaging with surface‑mount compatibility supports dense PCB layouts.
• Defined power envelope — Narrow core voltage range (0.820–0.880 V) assists in power supply design and sequencing.
• Commercial temperature rating — Rated 0 °C to 85 °C for applications within standard commercial environments.

Why Choose 5SGXEA5K2F40C2L?

The 5SGXEA5K2F40C2L balances high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package, making it suitable for complex programmable designs that require integration and board‑level density. Its commercial temperature rating and defined electrical characteristics provide clear integration parameters for system architects and hardware engineers.

This device is positioned for customers who need a single FPGA solution to consolidate multiple functions, reduce external components, and maintain predictable power and thermal behavior within commercial operating ranges; detailed device characteristics are available in the Stratix V device datasheet for design validation.

Request a quote or submit a sales inquiry to learn more about pricing, availability, and integration support for the 5SGXEA5K2F40C2L.