5SGXEA5K2F35I3N

The 5SGXEA5K2F35I3N is a Stratix V GX field-programmable gate array (FPGA) from Intel, offering high logic density and substantial on-chip memory for complex digital designs. This surface-mount FCBGA device provides a large I/O count and industrial-grade operating range, making it suitable for demanding embedded and communications applications.

Designed for systems that require dense programmable logic, significant embedded RAM, and robust I/O integration, the device balances performance and integration with a core voltage operating range that supports modern low-voltage FPGA designs.

Key Features

• High Logic Density  490,000 logic elements to implement complex digital functions and large programmable logic designs.
• Substantial Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, packet processing, and embedded data storage.
• Generous I/O Count  432 user I/Os to accommodate wide bus interfaces, parallel peripherals, and board-level connectivity.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to support industrial environments and extended-temperature systems.
• Low-Voltage Core Supply  Core voltage supply range of 820 mV to 880 mV to match low-voltage system architectures.
• Package & Mounting  1152-BBGA/1152-FBGA (35×35) surface-mount package for compact board-level integration and high pin density.
• RoHS Compliant  Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-performance Networking  Use the device’s logic density and on-chip RAM for packet processing, protocol handling, and hardware-accelerated networking functions.
• Telecommunications & Optical Systems  High I/O count and Stratix V GX family characteristics suit data-path control and interface aggregation in telecom equipment.
• Industrial Control & Automation  Industrial temperature rating and robust I/O support motor control, sensor aggregation, and custom control logic in factory systems.
• Data Processing & Accelerator Boards  Large programmable fabric and embedded memory enable custom data-path accelerators, DSP functions, and real-time processing.

Unique Advantages

• High integration in a single device: 490,000 logic elements plus approximately 46 Mbits of embedded RAM reduce external component count and simplify system design.
• Large I/O surface: 432 I/Os provide flexibility for interfacing to peripherals, high-speed buses, and multi-lane board layouts.
• Industrial-ready thermal range: −40 °C to 100 °C enables deployment in temperature-challenging environments without additional thermal qualification assumptions.
• Compact, high-density package: 1152-FBGA (35×35) surface-mount package delivers a high pin count in a compact footprint for space-constrained boards.
• Low-voltage core compatibility: 820–880 mV core supply range aligns with contemporary low-voltage FPGA power domains to support efficient power distribution.
• Standards-aware manufacturing: RoHS compliance supports lead-free assembly and environmental objectives.

Why Choose 5SGXEA5K2F35I3N?

This Stratix V GX FPGA combines high programmable logic capacity, substantial embedded memory, and a broad I/O complement in an industrial-grade, surface-mount package. It is positioned for engineers who need a single programmable device to implement complex algorithms, offload compute tasks, and integrate multiple interfaces while meeting extended temperature requirements.

Backed by Stratix V family documentation from Intel, the 5SGXEA5K2F35I3N offers a clear specification set for architects and procurement teams seeking a scalable, high-density FPGA solution for communications, industrial systems, and data-processing applications.

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