5SGXEA5K2F35I3L

The 5SGXEA5K2F35I3L is a Stratix V GX family FPGA in an industrial-grade configuration, offering very large programmable logic capacity and substantial on-chip RAM. It is targeted at designs that require high-density logic, abundant embedded memory, and a large number of I/O pins in a compact surface-mount 1152-FBGA package.

Key value propositions are its high logic capacity (490,000 logic elements), approximately 46 Mbits of embedded memory, and support for industrial operating conditions, making it suitable for demanding embedded and system-level designs that need both integration and robustness.

Key Features

• Logic Capacity — Approximately 490,000 logic elements for implementing complex custom logic and large-scale programmable functions.
• Embedded Memory — Total on-chip RAM of 46,080,000 bits (approximately 46 Mbits) to support data buffering, packet processing, and intermediate storage without external memory.
• I/O Resources — 432 I/O pins to interface with multiple peripherals, high-density connectors, or parallel buses.
• Package & Mounting — 1152-FBGA (35×35) surface-mount package (supplier device package listed as 1152-FBGA) for high pin-count, compact board designs.
• Power — Core supply voltage range of 820 mV to 880 mV to match targeted FPGA core power domains.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for extended temperature range deployment.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free manufacturing.
• Series Documentation — Stratix V device datasheet provides device- and series-level electrical and switching characteristics, including transceiver and I/O timing details for Stratix V GX devices.

Typical Applications

• High-density programmable logic — Designs requiring approximately 490,000 logic elements and substantial on-chip RAM for complex algorithm implementation and data-path acceleration.
• Large I/O count systems — Systems that need up to 432 dedicated I/O pins for sensor arrays, high-channel-count interfaces, or multi-lane front-end connectivity.
• Industrial-grade embedded systems — Applications that require operation across −40 °C to 100 °C and RoHS compliance in a surface-mount 1152-FBGA form factor.

Unique Advantages

• High integration density: Large logic element count and ~46 Mbits of embedded memory reduce dependence on external components and simplify board-level design.
• Robust industrial operation: Rated for −40 °C to 100 °C, enabling deployment in environments with wide temperature ranges.
• Extensive I/O capability: 432 I/O pins provide design flexibility for interfacing with multiple subsystems and high-throughput external devices.
• Compact high-pin-count package: 1152-FBGA (35×35) enables high-density routing and minimized PCB footprint for space-constrained systems.
• Controlled core voltage: Narrow core supply window (0.82–0.88 V) facilitates predictable power budgeting and core-level optimization.
• Standards-aligned supply chain: RoHS compliance supports lead-free manufacturing flows.

Why Choose 5SGXEA5K2F35I3L?

The 5SGXEA5K2F35I3L positions itself as a high-density, industrial-grade Stratix V GX FPGA option, offering a combination of large logic capacity, significant embedded memory, extensive I/O, and a compact 1152-FBGA surface-mount package. These characteristics make it well suited for system designs that require integration of complex digital functions while meeting industrial temperature and environmental requirements.

Designers and procurement teams seeking a robust FPGA platform with documented series-level electrical and switching characteristics can leverage the Stratix V device documentation to assess integration, power, and timing for long-term, scalable deployments.

Request a quote or submit a purchase inquiry today to evaluate 5SGXEA5K2F35I3L for your next high-density, industrial FPGA design.