5SGXEA5K2F35I3LG

The 5SGXEA5K2F35I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35) package. This industrial‑grade device delivers large on‑chip logic and memory capacity with a wide operating temperature range for embedded and board‑level applications that require dense programmable logic and significant I/O integration.

Its core architecture provides high logic capacity, substantial embedded RAM, and a large I/O count, enabling consolidation of complex digital functions into a single device while operating from a low-voltage core supply.

Key Features

• Logic Capacity — 490,000 logic elements for implementing extensive custom logic and state machines.
• Embedded Memory — Total RAM bits: 46,080,000 (approximately 46.08 Mbits) to support on‑chip buffering, register files, and memory‑intensive logic.
• I/O Integration — 432 general-purpose I/O pins to support multiple parallel interfaces and high pin‑count designs.
• Package and Mounting — Supplier device package 1152‑FBGA (35×35); package case listed as 1152‑BBGA, FCBGA; surface mount mounting type for standard PCB assembly.
• Power — Core voltage supply range of 820 mV to 880 mV, suitable for designs targeting the specified core supply window.
• Temperature and Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for use in demanding environmental conditions.
• Compliance — RoHS compliant.

Typical Applications

• High‑density programmable logic systems — For implementations that require up to 490,000 logic elements and substantial on‑chip RAM to consolidate multiple functions.
• I/O‑intensive interface hubs — Suitable for designs needing a high number of I/Os (432) to connect many peripherals or parallel buses.
• Industrial embedded platforms — Industrial temperature rating (−40 °C to 100 °C) makes the device appropriate for industrial control and instrumentation equipment.

Unique Advantages

• High logic density: 490,000 logic elements allow complex designs to be implemented in a single device, reducing board‑level component count.
• Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM supports large buffers and memory‑intensive algorithms without external memory.
• Large I/O complement: 432 I/Os minimize the need for external multiplexers or interface chips when connecting many signals.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in challenging temperature environments.
• Compact BGA packaging: 1152‑FBGA (35×35) package enables high‑density board layouts while supporting surface‑mount assembly.
• RoHS compliant: Conforms to RoHS requirements for material compliance.

Why Choose 5SGXEA5K2F35I3LG?

The 5SGXEA5K2F35I3LG positions itself as a high‑capacity Stratix V GX FPGA option that combines large logic and memory resources with a substantial I/O count in a compact BGA package. Its industrial temperature grade and RoHS compliance make it a practical choice for designs that require robust environmental tolerance and material compliance.

Engineers seeking to consolidate complex programmable logic, reduce board‑level components, and maintain flexibility for design updates will find this device suitable for demanding embedded and industrial applications.

If you would like pricing, availability, or a formal quote for 5SGXEA5K2F35I3LG, submit a quote request or sales inquiry and our team will respond with the next steps.