5SGXEA5K2F35I2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA

Quantity 1,831 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5K2F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 490,000 logic elements

The 5SGXEA5K2F35I2N is a Stratix® V GX field programmable gate array from Intel, providing a high-density programmable logic fabric in a 1152-ball FCBGA package. This device combines a large logic element count with substantial on-chip RAM and a high I/O count for systems that require significant programmable resources.

Designed for industrial-temperature operation, the device supports a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for demanding embedded and industrial applications that need robust thermal and power operating windows.

Key Features

  • Core Logic Capacity  Approximately 490,000 logic elements provide extensive programmable logic for complex digital designs.
  • Logic Array Blocks  Approximately 185,000 logic array blocks provide hierarchical resources for efficient design mapping and partitioning.
  • Embedded Memory  Approximately 46 Mbits of embedded memory for buffering, on-chip storage, and data processing acceleration.
  • High I/O Count  432 general-purpose I/O pins to interface with a wide range of external devices and high-pin-count systems.
  • Package & Mounting  1152-BBGA / 1152-FBGA (35 × 35) FCBGA package supplied for surface-mount assembly in compact board designs.
  • Power Requirements  Core voltage supply in the range of 870 mV to 930 mV to match platform power delivery designs.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for use in industrial environments.
  • Compliance  RoHS compliant.

Typical Applications

  • High-density logic processing  Use the large logic element count and abundant memory to implement complex state machines, custom datapaths, and hardware accelerators.
  • Embedded systems and SoC prototyping  High I/O count and sizeable on-chip RAM enable system-level prototyping and integration of multiple peripherals and interfaces on a single FPGA.
  • Industrial control and automation  Industrial temperature grade and robust operating voltage range support control, monitoring, and deterministic logic functions in industrial environments.
  • Data buffering and packet processing  Approximately 46 Mbits of embedded memory and high logic density support packet handling, buffering, and real-time data manipulation tasks.

Unique Advantages

  • Large programmable fabric: The 490,000 logic elements enable implementation of substantial custom logic and parallel processing architectures on a single device.
  • Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduce external memory dependency and improve latency for data-intensive functions.
  • High I/O capability: 432 I/O pins provide flexibility to connect multiple high-pin-count interfaces without complex external multiplexing.
  • Industrial robustness: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
  • Compact, board-ready package: 1152-ball FCBGA package (35 × 35) supports surface-mount assembly for space-constrained designs.
  • Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXEA5K2F35I2N?

The 5SGXEA5K2F35I2N positions itself for designs that require substantial programmable logic, a large embedded memory budget, and extensive I/O in an industrial-temperature FPGA. Backed by the Stratix V GX device family documentation, this device is suited to engineers building high-capacity, memory-rich FPGA solutions where board-level integration and thermally robust operation are priorities.

For teams focused on long-term platform scalability and hardware reconfigurability, the combination of logic density, embedded RAM, and a high I/O count provides a foundation for evolving designs while minimizing external component needs.

If you would like pricing, lead-time details, or to request a formal quote for 5SGXEA5K2F35I2N, submit your inquiry and our sales team will respond with current availability and ordering options.

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