5SGXEA5K2F35I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,831 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5K2F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 490,000 logic elements
The 5SGXEA5K2F35I2N is a Stratix® V GX field programmable gate array from Intel, providing a high-density programmable logic fabric in a 1152-ball FCBGA package. This device combines a large logic element count with substantial on-chip RAM and a high I/O count for systems that require significant programmable resources.
Designed for industrial-temperature operation, the device supports a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C, making it suitable for demanding embedded and industrial applications that need robust thermal and power operating windows.
Key Features
- Core Logic Capacity Approximately 490,000 logic elements provide extensive programmable logic for complex digital designs.
- Logic Array Blocks Approximately 185,000 logic array blocks provide hierarchical resources for efficient design mapping and partitioning.
- Embedded Memory Approximately 46 Mbits of embedded memory for buffering, on-chip storage, and data processing acceleration.
- High I/O Count 432 general-purpose I/O pins to interface with a wide range of external devices and high-pin-count systems.
- Package & Mounting 1152-BBGA / 1152-FBGA (35 × 35) FCBGA package supplied for surface-mount assembly in compact board designs.
- Power Requirements Core voltage supply in the range of 870 mV to 930 mV to match platform power delivery designs.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for use in industrial environments.
- Compliance RoHS compliant.
Typical Applications
- High-density logic processing Use the large logic element count and abundant memory to implement complex state machines, custom datapaths, and hardware accelerators.
- Embedded systems and SoC prototyping High I/O count and sizeable on-chip RAM enable system-level prototyping and integration of multiple peripherals and interfaces on a single FPGA.
- Industrial control and automation Industrial temperature grade and robust operating voltage range support control, monitoring, and deterministic logic functions in industrial environments.
- Data buffering and packet processing Approximately 46 Mbits of embedded memory and high logic density support packet handling, buffering, and real-time data manipulation tasks.
Unique Advantages
- Large programmable fabric: The 490,000 logic elements enable implementation of substantial custom logic and parallel processing architectures on a single device.
- Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduce external memory dependency and improve latency for data-intensive functions.
- High I/O capability: 432 I/O pins provide flexibility to connect multiple high-pin-count interfaces without complex external multiplexing.
- Industrial robustness: Rated for −40 °C to 100 °C operation to meet the thermal demands of industrial deployments.
- Compact, board-ready package: 1152-ball FCBGA package (35 × 35) supports surface-mount assembly for space-constrained designs.
- Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose 5SGXEA5K2F35I2N?
The 5SGXEA5K2F35I2N positions itself for designs that require substantial programmable logic, a large embedded memory budget, and extensive I/O in an industrial-temperature FPGA. Backed by the Stratix V GX device family documentation, this device is suited to engineers building high-capacity, memory-rich FPGA solutions where board-level integration and thermally robust operation are priorities.
For teams focused on long-term platform scalability and hardware reconfigurability, the combination of logic density, embedded RAM, and a high I/O count provides a foundation for evolving designs while minimizing external component needs.
If you would like pricing, lead-time details, or to request a formal quote for 5SGXEA5K2F35I2N, submit your inquiry and our sales team will respond with current availability and ordering options.

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