5SGXEA5K2F35I2L

The 5SGXEA5K2F35I2L is an Intel Stratix® V GX field programmable gate array (FPGA) device in a 1152-BBGA FCBGA package. It integrates approximately 490,000 logic elements and roughly 46.08 Mbits of embedded RAM to support high-density digital designs.

Designed and specified for industrial operation, the device offers a high I/O count (432 pins), a low-voltage core supply range (820 mV to 880 mV), and a wide operating temperature window (–40 °C to 100 °C), making it suitable for demanding system-level integration where logic capacity, memory, and I/O density are primary considerations.

Key Features

• High logic density — Approximately 490,000 logic elements to implement large, complex digital functions on a single device.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and requirement for local data storage.
• High I/O count — 432 I/O pins for extensive external interfacing and parallel connectivity.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C to meet industrial thermal requirements.
• Low-voltage core — Core supply specified from 820 mV to 880 mV for integration into low-voltage system power rails.
• Package and mounting — 1152-BBGA (35 × 35) FCBGA supplier device package in a surface-mount form factor for compact board-level integration.
• Regulatory status — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• High-density processing engines — Use the large logic fabric and on-chip RAM for compute-intensive FPGA tasks that require significant logic and local memory resources.
• High-pin-count interface hubs — Leverage 432 I/Os to aggregate multiple external interfaces or to drive parallel interfaces and wide buses.
• Industrial control and instrumentation — Industrial temperature rating and robust packaging support deployment in industrial environments where a wide operating temperature is required.
• Memory-heavy embedded systems — Approximately 46.08 Mbits of embedded RAM enables buffering and in-device storage for data-path and stateful applications.

Unique Advantages

• Large on-chip logic capacity: Approximately 490,000 logic elements reduce the need for multi-chip implementations and simplify system architecture.
• Significant embedded memory: Roughly 46.08 Mbits of RAM allows for in-place data handling and accelerates memory-bound operations.
• Extensive external connectivity: 432 I/O pins provide flexibility for complex interfacing, sensor aggregation, or parallel data transfers.
• Industrial-grade thermal range: Specified for −40 °C to 100 °C operation, helping ensure reliable behavior in demanding temperature environments.
• Compact surface-mount package: 1152-BBGA (35 × 35) FCBGA packaging supports high-density PCB designs while providing a standardized mounting footprint.
• RoHS compliant: Designed for environmentally conscious manufacturing and regulatory compliance.

Why Choose 5SGXEA5K2F35I2L?

The 5SGXEA5K2F35I2L combines high logic element count, substantial embedded RAM, and a large I/O complement in a single industrial-grade FPGA package. These attributes make it well suited for designs that demand on-chip integration of complex logic, significant local memory, and broad external connectivity without resorting to multi-device solutions.

For engineering and procurement teams targeting scalable, high-density FPGA implementations in industrial environments, this device offers a balance of capacity, thermal robustness, and a compact surface-mount package that supports long-term deployment and system consolidation.

Request a quote or submit a purchase inquiry today to evaluate 5SGXEA5K2F35I2L for your next FPGA-based design.