5SGXEA5K2F35C3G

The 5SGXEA5K2F35C3G is a Stratix® V GX field programmable gate array (FPGA) packaged in a 1152-ball BGA (35×35) footprint. It delivers a high-capacity programmable fabric with substantial on-chip memory and plentiful I/O for complex, I/O‑intensive designs.

As a commercial-grade Stratix V GX device, it is presented with the electrical and switching characteristics defined in the Stratix V device datasheet and is intended for applications that require large programmable logic capacity, extensive embedded memory, and high I/O count.

Key Features

• Programmable Logic Capacity  490,000 logic elements suitable for large-scale integration and complex logic designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and data‑intensive processing.
• I/O Density  432 user I/O pins to support wide parallel interfaces and numerous peripheral connections.
• Package & Mounting  1152-ball BGA / 1152-FBGA (35×35) package designed for surface-mount assembly.
• Power  Core supply voltage range specified at 0.820 V to 0.880 V for precise core-power planning.
• Operating Range  Commercial temperature grade rated from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory compatibility.
• Family Characteristics  Part of the Stratix V GX family with device-level electrical and switching characteristics described in the Stratix V device datasheet.

Typical Applications

• High-density logic systems  Large programmable fabric and abundant logic elements make the device suitable for systems requiring significant custom logic integration.
• Memory-intensive processing  Approximately 46.08 Mbits of embedded RAM supports buffering, packet processing, and on-chip data handling.
• I/O-heavy interfaces  432 I/O pins enable connection to multiple parallel buses, sensors, and peripherals for complex system integration.
• Transceiver-enabled designs  As a Stratix V GX device, it aligns with systems that use high-speed transceiver-capable families as described in the device documentation.

Unique Advantages

• High logic density: 490,000 logic elements reduce the need for multi-chip solutions and simplify system architecture.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM enables large internal buffers and accelerates data-path implementation.
• Extensive I/O: 432 I/O pins allow flexible interface options and support for multiple concurrent peripherals.
• Commercial temperature rating: Designed for standard commercial environments with an operating range of 0 °C to 85 °C.
• Industry-standard BGA package: 1152‑ball BGA (35×35) footprint supports mainstream PCB assembly and thermal planning.
• Regulatory readiness: RoHS compliance supports global environmental requirements.

Why Choose 5SGXEA5K2F35C3G?

The 5SGXEA5K2F35C3G provides a balanced combination of high logic capacity, significant embedded memory, and a large I/O complement in a 1152-ball BGA package. It is positioned for engineers and teams developing large-scale programmable systems that require substantial on-chip resources and flexible I/O while operating in commercial temperature environments.

Backed by the Stratix V family documentation, this device fits designs that prioritize integration density, on-chip memory bandwidth, and I/O scalability, offering a path for scalable, long-term deployment within the Stratix V ecosystem.

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