5SGXEA5K2F35C2LG

The 5SGXEA5K2F35C2LG is a Stratix® V GX field programmable gate array (FPGA) from Intel, provided in a high-density 1152‑BBGA (35×35) FCBGA package. It delivers a large logic fabric and embedded RAM to support complex, high‑integration digital designs in commercial temperature environments.

With 490,000 logic elements, approximately 46 Mbits of on‑chip RAM, and 432 user I/Os, this device targets applications that require substantial custom logic capacity, significant embedded memory, and dense I/O connectivity while operating from a low-voltage core supply.

Key Features

• Core / Logic  490,000 logic elements for implementing large-scale custom logic and complex state machines.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, LUT‑based memory, and data path storage directly in the FPGA fabric.
• I/O Capacity  432 user I/Os to support multi‑lane interfaces, parallel buses, and extensive peripheral connectivity.
• Power / Voltage  Core supply range 820 mV to 880 mV, enabling operation at low core voltages specified for Stratix V devices.
• Package & Mounting  1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35); surface‑mount mounting for high‑density PCB integration.
• Temperature & Grade  Commercial temperature grade with an operating range of 0°C to 85°C, suitable for commercial and lab environments.
• Compliance  RoHS compliant.
• Family Documentation  Part of the Stratix V GX family; Stratix V devices are offered in defined commercial speed grades and transceiver offerings as documented in the device datasheet.

Typical Applications

• Complex digital system integration  Use the large logic element count and embedded RAM to implement high‑density custom logic, protocol bridges, and packet processing engines.
• High‑density I/O interfacing  432 user I/Os provide the channel count and pinout flexibility needed for multi‑bus systems, sensor arrays, or dense peripheral connectivity.
• Platform prototyping and validation  The surface‑mount FCBGA package and commercial grade make this device suitable for development platforms and system validation in controlled environments.

Unique Advantages

• High logic density: 490,000 logic elements enable consolidation of large areas of custom logic into a single device, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM reduce external memory dependence for buffering and data‑path operations.
• Extensive I/O count: 432 user I/Os allow flexible interfacing to multiple subsystems without additional I/O expander components.
• Low core voltage operation: 820 mV–880 mV supply range aligns with modern low‑voltage FPGA core requirements.
• Commercial temperature suitability: Rated 0°C to 85°C for commercial applications and development environments.
• Environmental compliance: RoHS compliance supports regulatory requirements for electronic assemblies.

Why Choose 5SGXEA5K2F35C2LG?

The 5SGXEA5K2F35C2LG offers a high‑capacity Stratix V GX FPGA platform for designs that demand abundant logic resources, significant on‑chip memory, and broad I/O connectivity in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for development, prototyping, and commercial deployments where these attributes are required.

Engineers selecting this device benefit from the Stratix V family documentation and Intel’s device specifications, enabling integration into complex digital systems that require scalable logic, embedded memory, and high I/O counts while operating at a low core voltage.

Request a quote or submit your design requirements to receive pricing and availability for the 5SGXEA5K2F35C2LG. Our team can provide additional configuration details and support for integration into your project.