5SGXEA5K2F35C3N

The 5SGXEA5K2F35C3N is a Stratix® V GX field programmable gate array (FPGA) from Intel designed for high-density programmable logic implementations. It combines approximately 490,000 logic elements with roughly 46 Mbits of on-chip RAM and a high user I/O count to address complex system integration needs.

Targeted at commercial-grade applications, this device ships in a 1152-ball FCBGA footprint and operates from a low-voltage core supply, making it suitable for designs that require significant logic capacity, embedded memory, and extensive I/O connectivity.

Key Features

• Core Logic Capacity  Approximately 490,000 logic elements to support large, complex logic designs and high-density implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to store buffers, lookup tables, and state without external memory for many functions.
• User I/O  432 user I/O pins for broad interfacing capability with peripherals, sensors, and external devices.
• Package  Provided in a 1152-FBGA (35×35) / 1152-BBGA FCBGA package for dense board-level integration.
• Low-Voltage Core  Core supply range of 820 mV to 880 mV to support low-voltage power architectures.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to meet standard commercial-environment requirements.
• Standards Compliance  RoHS compliant, supporting regulatory requirements for lead-free manufacturing.
• Stratix V GX Family  Part of the Stratix V GX family of devices, offering the electrical and switching characteristics documented for the series.

Typical Applications

• High-density programmable logic  Implement large-scale custom logic functions and algorithm acceleration using the device's ~490k logic elements and substantial embedded memory.
• Data buffering and packet processing  Use the ~46 Mbits of on-chip RAM for packet buffers, FIFOs, and temporary storage in throughput-oriented designs.
• Multi-interface system integration  Leverage 432 I/Os to interface with multiple external peripherals, sensors, and converters on compact PCBs.

Unique Advantages

• High integration density: The large logic-element count enables consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM minimizes dependence on external memory for many buffering and storage tasks.
• Extensive I/O resources: 432 user I/Os provide flexible connectivity options for complex multi-peripheral systems.
• Compact, industry-standard package: 1152-ball FCBGA (35×35) packaging supports high-density board designs while preserving signal routing options.
• Low-voltage core operation: 820 mV–880 mV supply range aligns with low-power core architectures and modern power system designs.
• Commercial-grade readiness: Rated 0 °C to 85 °C for a wide range of general-purpose, commercial-environment applications.

Why Choose 5SGXEA5K2F35C3N?

The 5SGXEA5K2F35C3N delivers a balance of large logic capacity, significant embedded memory, and broad I/O in a single commercial-grade Stratix V GX FPGA. Its combination of approximately 490,000 logic elements, ~46 Mbits of on-chip RAM, and 432 I/Os makes it well suited for complex, high-density designs that require on-chip resources to reduce external components and simplify system architecture.

Backed by Intel's Stratix V family documentation and RoHS compliance, this device offers a scalable platform for commercial FPGA projects where integration, memory capacity, and I/O density are priorities.

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