5SGXEA5K2F35C2N

The 5SGXEA5K2F35C2N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152‑FBGA package. It delivers a high-density, commercial‑grade programmable fabric with substantial embedded memory and a large I/O count for complex digital designs.

With approximately 490,000 logic elements, roughly 46 Mbits of on‑chip RAM, and 432 user I/O, this device targets applications that require dense logic capacity, significant embedded memory, and extensive board-level interfacing while operating within commercial temperature limits.

Key Features

• Logic Capacity  Approximately 490,000 logic elements suitable for large, multi‑functional FPGA designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density  432 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting  1152‑BBGA / 1152‑FBGA package (35×35) in a surface‑mount format for board‑level integration.
• Supply Voltage  Rated voltage supply range of 870 mV to 930 mV, enabling designs that target this core voltage window.
• Commercial Temperature Grade  Specified operating temperature from 0 °C to 85 °C for commercial applications.
• RoHS Compliance  Environmentally compliant (RoHS).

Typical Applications

• High‑density digital processing  Large FPGA implementations that require substantial logic and embedded memory for algorithms, DSP, or packet processing.
• Multi‑interface systems  Board designs that need many parallel or serial interfaces supported by a high I/O count.
• Prototyping and system integration  Complex system prototypes and integration platforms that leverage reprogrammable logic and sizable on‑chip RAM.

Unique Advantages

• Substantial logic resources  Approximately 490,000 logic elements reduce the need for external glue logic and enable more functionality in a single device.
• Large embedded memory  Approximately 46 Mbits of on‑chip RAM supports deep buffering and localized data storage, lowering external memory dependence.
• High I/O count  432 I/O pins provide flexibility for complex interfacing and multiple simultaneous connections.
• Compact surface‑mount package  1152‑FBGA packaging delivers high density in a board‑mountable form factor for space‑constrained designs.
• Commercial temperature and RoHS compliant  Designed for commercial environments with RoHS environmental compliance for broader market acceptance.

Why Choose 5SGXEA5K2F35C2N?

The 5SGXEA5K2F35C2N combines high logic density, considerable embedded memory, and a large I/O complement in a single commercial‑grade Stratix V GX FPGA. This device is suited for developers and system designers who must consolidate complex digital functions into one programmable device while maintaining a compact board footprint.

Its specification set—nearly half a million logic elements, roughly 46 Mbits of RAM, 432 I/O, and a 1152‑FBGA package—offers a clear path to reduce external components and simplify system architecture, with predictable operating conditions across the commercial temperature range.

Request a quote or submit a sales inquiry to evaluate 5SGXEA5K2F35C2N for your next high‑density FPGA design.