5SGXEA5K2F35C2G

The 5SGXEA5K2F35C2G is an Intel Stratix® V GX field-programmable gate array (FPGA) device designed for high-density programmable logic and on-chip memory integration. This commercial-grade FPGA delivers approximately 490,000 logic elements, roughly 46 Mbits of embedded memory, and 432 I/O pins in a 1152‑BBGA (35×35 FCBGA) surface-mount package.

As part of the Stratix V GX family, the device is aligned with the series’ transceiver speed-grade offerings and device-level documentation. The device operates on a core voltage supply range of 870 mV to 930 mV and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core density  Approximately 490,000 logic elements with 185,000 logic array blocks (LABs) to implement large-scale logic, datapaths, and custom accelerators.
• Embedded memory  Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive logic functions.
• I/O and transceiver family support  432 user I/Os provided in the 1152‑BBGA package; Stratix V GX family documentation includes GX transceiver speed-grade options at the series level.
• Power and core voltage  Core supply voltage specified between 870 mV and 930 mV to support regulated core operation.
• Package and mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA 35×35) optimized for surface-mount PCB assembly.
• Commercial grade and temperature range  Commercial-grade device with operating temperature specified from 0 °C to 85 °C.
• Regulatory compliance  RoHS compliant.

Typical Applications

• High-speed communications  Leverage the Stratix V GX family’s transceiver speed-grade offerings together with dense logic and on-chip memory for protocol bridging and line-rate packet processing.
• Networking and switching  High logic density and abundant I/O make the device suitable for custom switching, packet inspection, and hardware offload functions.
• Data acceleration  Large embedded RAM and extensive logic resources support implementation of hardware accelerators and data-path optimizations.

Unique Advantages

• Significant logic capacity: The combination of ~490,000 logic elements and 185,000 LABs enables complex, high-density designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces external memory dependence and improves data locality for high-throughput designs.
• Compact, production-ready package: 1152‑BBGA (35×35 FCBGA) surface-mount package provides a space-efficient solution for system integration.
• Predictable commercial operation: Specified core voltage range and 0 °C to 85 °C operating temperature simplify power budgeting and thermal planning for standard commercial deployments.
• RoHS compliant: Meets common environmental compliance requirements for modern electronic products.

Why Choose 5SGXEA5K2F35C2G?

The 5SGXEA5K2F35C2G positions itself as a high-density Stratix V GX FPGA option for designs that require extensive programmable logic, significant on-chip memory, and a large I/O footprint in a single commercial-grade package. Its specified core voltage range and operating temperature make it suitable for a broad range of commercial embedded, communications, and data-acceleration applications.

Engineers and system designers seeking a robust, well-documented Stratix V GX family device will find this part offers the capacity and integration necessary to consolidate functions, reduce board complexity, and support demanding logic and memory requirements.

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