5SGXEA5K2F35C2L

The 5SGXEA5K2F35C2L is a Stratix V GX field-programmable gate array (FPGA) device optimized for high-density digital logic and memory-intensive designs. As a commercial-grade Stratix V GX part, it delivers a combination of large logic capacity, substantial on-chip RAM, and extensive I/O count for complex system implementations.

Key value comes from its high logic element count, approximately 46 Mbits of embedded memory, and a 432-pin I/O capability packaged in a 1152-BBGA FCBGA footprint, enabling compact, surface-mount deployment in board-level designs.

Key Features

• Core logic density — 490,000 logic elements suitable for large-scale FPGA designs that require significant programmable logic resources.
• Embedded memory — Approximately 46 Mbits of on-chip RAM to support memory-intensive algorithms and large buffering requirements.
• I/O capability — 432 I/O pins to support wide parallel interfaces and dense connectivity to peripherals and daughtercards.
• Power supply — Core voltage range of 0.820 V to 0.880 V to match system power-rail constraints and design margins.
• Package and mounting — 1152-BBGA (FCBGA) supplier package (1152-FBGA, 35×35); surface-mount mounting for automated PCB assembly.
• Operating conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial applications.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic designs — Deploy complex, large-capacity FPGA logic leveraging the 490,000 logic elements for state machines, custom datapaths, and glue logic.
• Memory-intensive processing — Use the approximately 46 Mbits of embedded RAM for buffering, packet queues, and on-chip data storage.
• I/O-dense systems — Integrate wide parallel interfaces and multiple peripherals using the device’s 432 I/O pins in a compact BGA footprint.

Unique Advantages

• High programmable capacity: 490,000 logic elements allow consolidation of large functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Approximately 46 Mbits of RAM supports large buffers and local data storage without external memory dependency.
• Robust I/O count: 432 I/Os enable flexible interfacing options for parallel buses, sensor arrays, or multi-channel data paths.
• Compact BGA package: 1152-BBGA (35×35) FCBGA packaging provides a high-pin-count solution in a space-efficient, surface-mount form factor.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• Standards-compliant materials: RoHS compliance supports regulatory requirements for many commercial products.

Why Choose 5SGXEA5K2F35C2L?

The 5SGXEA5K2F35C2L positions itself where large logic capacity, significant embedded memory, and high I/O count are required in a commercial-temperature FPGA. Its combination of 490,000 logic elements, approximately 46 Mbits of on-chip RAM, and 432 I/Os packaged in a 1152-BBGA FCBGA makes it suitable for designers consolidating complex digital functions into a single device while maintaining a compact board footprint.

Choose this part when your design demands high programmable density, extensive local memory, and a high number of interface signals in a surface-mount BGA package within standard commercial temperature limits.

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