5SGXEA5K2F35C2LN

The 5SGXEA5K2F35C2LN is a Stratix V GX field-programmable gate array (FPGA) device. It provides a high logic density with approximately 490,000 logic elements and approximately 46.08 Mbits of embedded memory for on-chip data storage.

Designed as a surface-mount FCBGA package, this device exposes 432 I/Os and operates from a core supply range of 820 mV to 880 mV with a commercial operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic Capacity Approximately 490,000 logic elements to implement large, complex digital designs.
• On-Chip Memory Approximately 46.08 Mbits of embedded RAM for local buffering, state storage, and memory-mapped functions.
• I/O Density 432 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting 1152-BBGA (1152-FBGA, 35 × 35 mm) FCBGA surface-mount package for compact system integration.
• Power Core voltage supply range from 820 mV to 880 mV for core power planning and regulator selection.
• Operating Temperature Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density logic integration — Implement large, complex logic networks and custom processing pipelines using up to 490,000 logic elements and substantial embedded memory.
• I/O‑intensive systems — Support parallel interfaces and multi-channel connectivity with 432 I/Os for broad system interfacing.
• Compact board-level FPGA solutions — Integrate into space-constrained, surface-mount designs using the 1152-FBGA (35 × 35 mm) package.
• Commercial temperature deployments — Suitable for applications operating within a 0 °C to 85 °C range.

Unique Advantages

• Large programmable fabric: Approximately 490,000 logic elements enable implementation of substantial custom logic without external ASICs.
• Significant embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces the need for external memory in many designs.
• High I/O count: 432 I/Os provide flexibility for multi-channel interfaces and wide parallel buses.
• Compact, production-ready package: 1152-FBGA (35 × 35 mm) surface-mount package supports high-density board layouts.
• Low-voltage core operation: Core supply range of 820–880 mV supports efficient power budgeting and regulator selection.
• Regulatory alignment: RoHS compliance for adherence to environmental requirements.

Why Choose 5SGXEA5K2F35C2LN?

The 5SGXEA5K2F35C2LN delivers a combination of high logic density, substantial on-chip memory, and a large I/O count in a compact FCBGA package. Its electrical and thermal operating points are specified for commercial-grade deployments, making it suitable for board-level systems that require significant programmable logic and local memory resources.

This device is suitable for engineers and teams designing complex digital systems that need to consolidate logic, memory, and I/O into a single programmable device while maintaining a small PCB footprint and defined power/temperature requirements.

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