5SGXEA5K2F35I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 46080000 490000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 854 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5K2F35I2G – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 Logic Elements
The 5SGXEA5K2F35I2G is an Intel Stratix V GX field programmable gate array (FPGA) delivered in a 1152-BBGA (35 × 35) surface-mount package. It integrates 490,000 logic elements and approximately 46 Mbits of embedded memory to support complex, high-density logic and buffering on a single device.
Designed for industrial-grade applications, this device provides up to 432 user I/O pins and operates across a 0.870–0.930 V core supply range, with an operating temperature rating from –40 °C to 100 °C. The Stratix V family datasheet includes detailed electrical, switching and I/O timing characteristics for system integration and design validation.
Key Features
- Logic Capacity 490,000 logic elements for large-scale programmable logic and complex digital designs.
- Logic Array Blocks 185,000 logic array blocks to structure and distribute logic resources efficiently across the device.
- Embedded Memory Approximately 46 Mbits of on-chip RAM to support deep buffering, large state machines, and on-chip data storage.
- High I/O Count 432 user I/O pins to interface with multiple high-speed peripherals, memory arrays, and daughtercards.
- Power Core voltage supply range of 0.870 V to 0.930 V for predictable power-domain design and supply planning.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C to meet industrial environmental requirements.
- Package and Mounting 1152-BBGA (supplier package listed as 1152-FBGA, 35 × 35), surface-mount package suitable for compact board-level integration.
- Standards Compliance RoHS-compliant to support modern electronics manufacturing and environmental requirements.
- Stratix V Family Characteristics Datasheet coverage includes electrical and switching characteristics, I/O timing, and transceiver speed-grade information for system-level planning.
Typical Applications
- High‑speed communications and networking Leverage the Stratix V GX family transceiver capabilities (datasheet lists GX channel speeds up to 14.1 Gbps and GT channel speeds up to 28.05 Gbps for the family) alongside abundant I/O for board- and system-level connectivity.
- Data buffering and protocol bridging Large on-chip RAM (approximately 46 Mbits) and extensive logic resources enable packet buffering, protocol conversion, and custom interface implementations.
- Compute‑intensive signal processing High logic element count and logic array blocks support complex DSP pipelines, real-time processing, and custom accelerators.
- Industrial control and instrumentation Industrial temperature rating (–40 °C to 100 °C) and high I/O count make the device suitable for robust control systems and instrumentation that require extensive interfacing.
Unique Advantages
- High logic density: 490,000 logic elements provide capacity for large designs without partitioning across multiple devices.
- Substantial embedded memory: Approximately 46 Mbits of on-chip RAM reduces external memory dependence and simplifies timing and routing for buffering tasks.
- Extensive I/O capability: 432 I/O pins support multiple parallel interfaces and high fan‑out system designs.
- Industrial readiness: Rated for –40 °C to 100 °C operation to meet common industrial environmental requirements.
- Compact, manufacturable package: 1152-BBGA (35 × 35) surface-mount package enables dense PCB layouts while maintaining assembly compatibility.
- Regulatory alignment: RoHS compliance supports modern manufacturing and end-product environmental requirements.
Why Choose 5SGXEA5K2F35I2G?
The 5SGXEA5K2F35I2G places large FPGA capacity, substantial embedded memory, and a high I/O count into a single industrial-grade package, making it well suited for complex, I/O- and memory-intensive applications. Its power and thermal ratings, combined with Stratix V family electrical and switching characterization in the datasheet, support reliable system-level integration and predictable deployment.
This device is appropriate for engineering teams building high-throughput communications equipment, data-path accelerators, or advanced industrial control systems that require high logic density, significant on‑chip RAM, and broad interfacing capability.
If you would like pricing, availability, or to request a quote for 5SGXEA5K2F35I2G, submit an inquiry or request a quote through your preferred procurement channel.

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