5SGXEA5K2F35I2LN

The Intel 5SGXEA5K2F35I2LN is a Stratix V GX Field Programmable Gate Array (FPGA) provided in a 1152-BBGA (FCBGA) package. It delivers high logic capacity with 490,000 logic elements and approximately 46 Mbits of embedded memory, together with 432 user I/O pins for dense system integration. Rated for industrial temperature operation and RoHS compliant, this device is specified for surface-mount assembly and low-voltage core operation.

Key Features

• Core logic  490,000 logic elements provide substantial programmable logic density for complex designs.
• Embedded memory  Approximately 46 Mbits of on-chip RAM to support large buffering, state machines, and data processing tasks.
• I/O count  432 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Power supply  Core voltage specified from 820 mV to 880 mV to match system power domains and enable predictable core-power planning.
• Package & mounting  1152-BBGA (supplier package listed as 1152-FBGA, 35×35) in a surface-mount form factor for compact, high-density PCB layouts.
• Operating temperature  Industrial temperature grade with specified operation from −40 °C to 100 °C.
• Regulatory  RoHS compliant.

Unique Advantages

• High programmable density: 490,000 logic elements enable consolidation of large FPGA functions into a single device, reducing board count and BOM complexity.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory supports large data buffers and on-device storage without external memory dependencies.
• Extensive I/O capability: 432 I/O pins provide flexible interfacing options for parallel buses, memory interfaces, and multiple external peripherals.
• Industrial robustness: Specified operation from −40 °C to 100 °C makes the device suitable for demanding temperature environments.
• Compact FCBGA package: The 1152-BBGA (1152-FBGA, 35×35) package supports high integration density on modern PCBs while enabling surface-mount assembly.
• Predictable core power: A defined core voltage window (820–880 mV) helps simplify power supply design and thermal planning.

Why Choose 5SGXEA5K2F35I2LN?

The 5SGXEA5K2F35I2LN combines high logic capacity, abundant embedded memory, and a large I/O complement in a compact FCBGA package, offering a solid platform for complex, high-density FPGA implementations. Its industrial temperature rating and RoHS compliance make it suitable for designs where environmental robustness and regulatory compliance are required.

This device is appropriate for engineering teams seeking a high-capacity Stratix V GX-class FPGA to consolidate functions, reduce external components, and achieve predictable power and thermal characteristics in surface-mount board designs.

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