5SGXEA5K2F35I2LG

The 5SGXEA5K2F35I2LG is an Intel Stratix® V GX field programmable gate array supplied in a 1152-BBGA FCBGA package. Designed for high-density programmable logic integration, this industrial-grade device provides large logic capacity, substantial embedded memory, and a high I/O count for complex digital systems.

Its combination of approximately 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 432 I/Os makes it suitable for demanding applications that require significant on-chip resources and system-level connectivity while operating across an industrial temperature range.

Key Features

• Core Logic Density  Approximately 490,000 logic elements to implement large-scale custom logic and complex algorithmic functions.
• Logic Array Blocks  185,000 logic array blocks for structured logic partitioning and resource allocation.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage without external memory dependency.
• I/O and Packaging  432 general-purpose I/Os in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount package suitable for high-density board designs.
• Power  Specified supply range of 820 mV to 880 mV for core operation, enabling predictable power planning and thermal design.
• Temperature Rating & Compliance  Industrial operating temperature range of −40 °C to 100 °C. RoHS compliant.

Typical Applications

• High-performance networking and telecom  Use the device’s high logic density and extensive I/O count to implement packet processing, protocol offload, and custom switching logic.
• Data acceleration and signal processing  Leverage the large embedded memory and logic resources for real-time DSP, pattern recognition, and data manipulation functions.
• Infrastructure and communications equipment  Industrial temperature rating and robust I/O make it suitable for equipment that requires continuous operation in controlled industrial environments.
• Custom hardware controllers  Deploy as the central programmable fabric for complex control, aggregation, or interface bridging tasks that demand significant on-chip resources.

Unique Advantages

• High integration density: Approximately 490,000 logic elements reduce the need for multiple devices by consolidating complex functions on a single FPGA.
• Substantial on-chip RAM: Around 46 Mbits of embedded memory supports large buffers and local data storage, simplifying external memory requirements.
• Extensive I/O capability: 432 I/Os provide flexibility for multi-channel designs and direct interfacing to peripherals and board-level networks.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in industrial environments where extended temperature tolerance is required.
• Compact, surface-mount package: 1152-BBGA (35×35) package enables high-density PCB layouts while supporting robust solder mounting.
• Compliance: RoHS status is compliant, aiding regulatory and manufacturing considerations.

Why Choose 5SGXEA5K2F35I2LG?

The 5SGXEA5K2F35I2LG Stratix V GX FPGA combines substantial logic capacity, significant embedded memory, and a high number of I/Os in a compact, surface-mount 1152-BBGA package. Its industrial temperature rating and defined core supply range support robust system-level design and reliable operation in demanding environments.

This device is suited for engineering teams building high-density programmable solutions that require on-chip memory, flexible I/O, and predictable power and thermal characteristics, backed by Intel’s Stratix V family documentation and support resources.

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