5SGXEA5K2F35I3LN

The 5SGXEA5K2F35I3LN is a Stratix® V GX field programmable gate array (FPGA) IC offering large programmable logic capacity and abundant on-chip memory for demanding embedded and communications applications. Built for industrial temperature operation, this device delivers 490,000 logic elements, approximately 46.08 Mbits of embedded memory, and 432 general-purpose I/O pins in a 1152-BBGA (35 × 35 mm) FCBGA package.

Key Features

• Logic Capacity  Provides 490,000 logic elements, enabling complex custom logic and large-scale integration on a single device.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms.
• I/O Density  432 I/O pins for flexible system interfacing and high channel counts in multi‑lane designs.
• Power Supply  Core voltage supply range specified from 820 mV to 880 mV for the device core rail.
• Package & Mounting  1152-BBGA (supplier package: 1152-FBGA, 35 × 35 mm) in a surface-mount FCBGA form factor for compact system integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to support industrial and rugged applications.
• RoHS Compliant  Manufactured in accordance with RoHS requirements.

Typical Applications

• Networking & Communications  High logic density and plentiful I/Os make this FPGA suitable for packet processing, switching fabrics, and protocol bridging implementations.
• Signal Processing  Large embedded RAM and extensive logic resources support DSP algorithms, filtering, and real‑time data processing pipelines.
• Data Center & Acceleration  Use as a hardware accelerator for compute‑intensive tasks where custom parallel logic and on‑chip memory reduce latency.
• Industrial Control  Industrial temperature rating and robust package options enable deployment in motor control, PLCs, and factory automation systems.

Unique Advantages

• High Logic Integration: 490,000 logic elements reduce the need for multiple FPGAs and simplify system architecture.
• Substantial On‑Chip Memory: Approximately 46.08 Mbits of embedded RAM supports large buffers and state machines without external memory.
• Extensive I/O Connectivity: 432 I/Os provide flexibility for dense interfaces, multi‑lane links, and mixed signal routing on a single device.
• Industrial‑Grade Operating Range: –40 °C to 100 °C rating supports deployment in harsh and temperature‑variable environments.
• Compact High‑Pin Package: 1152‑BBGA (35 × 35 mm) FCBGA package balances high pin count with a board‑space conscious footprint.
• Standards‑conscious Manufacturing: RoHS compliance supports environmentally mandated production requirements.

Why Choose 5SGXEA5K2F35I3LN?

The 5SGXEA5K2F35I3LN Stratix V GX FPGA pairs substantial logic capacity with significant on‑chip memory and high I/O density to address complex, high‑performance applications. Its industrial temperature rating and compact FCBGA package make it suitable for systems that require reliability in challenging environments while conserving board area.

Designers seeking a single FPGA platform to consolidate functions, accelerate data‑intensive algorithms, and support dense I/O configurations will find this device appropriate for scalable, long‑lifecycle designs backed by documented device specifications in the Stratix V series datasheet.

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