5SGXEA5N1F40C2LN

The 5SGXEA5N1F40C2LN is a Stratix V GX field-programmable gate array (FPGA) manufactured by Intel. It delivers a high-density programmable fabric with 490,000 logic elements and approximately 46.08 Mbits of embedded memory, combined with a large I/O count for complex system interfacing.

Offered in a commercial temperature grade (0 °C to 85 °C) and in a 1517-BBGA (FCBGA) 40×40 package, this device targets high-density, high-pin-count designs where integration of logic, on-chip RAM, and broad I/O are required. Detailed electrical and switching characteristics for the Stratix V family are documented in the device datasheet.

Key Features

• High Logic Density — 490,000 logic elements to implement large FPGA designs and complex custom logic functions.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive logic.
• Extensive I/O — 600 user I/Os for broad interfacing with peripherals, high-pin-count connectors, and multi-channel systems.
• Power Supply — Core voltage range specified from 820 mV to 880 mV for core power planning and regulator selection.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Package and Mounting — 1517-BBGA (FCBGA), supplier device package 1517-FBGA (40×40); surface-mount assembly for PCB integration.
• Family-Level Transceiver Options — As a Stratix V GX device, the family is documented with GX transceiver speed grades in the Stratix V device datasheet.
• Regulatory Compliance — RoHS compliant for materials and manufacturing process conformance.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded RAM to implement complex data-paths, accelerators, and custom processing pipelines.
• Multi-channel I/O systems — Leverage 600 I/Os to connect multiple sensors, interfaces, and external devices in communication or instrumentation platforms.
• Memory-intensive logic — Approximately 46.08 Mbits of on-chip RAM enables buffering, packet processing, and table-based functions without external memory for many use cases.

Unique Advantages

• Large programmable fabric — 490,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering BOM count.
• Substantial embedded memory — On-chip RAM capacity supports complex state machines, FIFOs, and data buffering, improving performance and system responsiveness.
• High I/O count — 600 I/Os provide flexibility to implement wide parallel buses, multiple interfaces, and sensor arrays without extensive external multiplexing.
• Commercial temperature suitability — Rated 0 °C to 85 °C for applications that operate in standard commercial environments.
• Surface-mount FCBGA packaging — 1517-BBGA (40×40) package enables compact board layouts while supporting high pin density.
• RoHS compliance — Meets lead-free environmental requirements for modern electronics manufacturing.

Why Choose 5SGXEA5N1F40C2LN?

The 5SGXEA5N1F40C2LN combines a high logic element count, sizable on-chip RAM, and an extensive I/O complement in a single commercial-grade FCBGA package, making it well suited for designs that require dense programmable logic and broad connectivity. As part of the Stratix V GX family from Intel, it is backed by comprehensive device documentation covering electrical and switching characteristics to assist system architects and hardware engineers during integration.

This device is appropriate for engineering teams building high-density, I/O-rich FPGA designs that need scalable logic capacity and embedded memory while operating within commercial temperature limits.

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