5SGXEA5N1F40C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,157 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5N1F40C1N – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEA5N1F40C1N is a Stratix V GX family Field Programmable Gate Array (FPGA) from Intel. It provides high logic density and extensive I/O capability in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package for commercial-grade applications.
With approximately 490,000 logic elements and roughly 46 Mbits of embedded memory, this device targets complex, high-capacity digital designs that require large on-chip memory and broad connectivity while operating within a commercial temperature range.
Key Features
- Core Logic Density Approximately 490,000 logic elements enable large, complex digital designs and deep custom logic implementation.
- Embedded Memory Approximately 46 Mbits of on-chip RAM provides substantial buffer and storage resources for data-intensive logic functions.
- I/O Capacity 600 I/O pins support extensive external interfacing and high-pin-count designs.
- Power Supply Operates from a core voltage supply range of 870 mV to 930 mV, allowing precise core power management.
- Package & Mounting 1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board-level integration.
- Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS compliant.
Unique Advantages
- High integration density: The large logic-element count reduces the need for multiple devices, simplifying board layout and lowering BOM complexity for feature-rich designs.
- Substantial on-chip memory: Approximately 46 Mbits of embedded RAM supports high-throughput data buffering and localized storage, reducing external memory dependence.
- Extensive external connectivity: 600 I/Os enable broad peripheral and multi-interface connectivity options on a single device.
- Compact, manufacturable package: The 1517-BBGA (40×40) surface-mount package balances pin density with PCB assembly convenience for high-volume production.
- Commercial temperature operation: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products.
- Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for lead-free manufacturing.
Why Choose 5SGXEA5N1F40C1N?
The 5SGXEA5N1F40C1N combines high logic capacity, substantial embedded memory, and a very large I/O count in a single commercial-grade Stratix V GX FPGA package. Its electrical and packaging specifications make it well suited to demanding, high-density digital designs that require significant on-chip resources and extensive external interfacing.
As a member of Intel's Stratix V GX family, this device is backed by family-level documentation and specification data to support integration into complex systems, providing designers with the detailed electrical and operating parameters needed for reliable implementation.
Request a quote or submit an inquiry to arrange pricing, availability, or to obtain the device datasheet and additional technical information to support your design evaluation and procurement.

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