5SGXEA5N1F40C1G

The 5SGXEA5N1F40C1G is an Intel Stratix V GX family FPGA supplied in a 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package. It delivers a large programmable fabric with 490,000 logic elements and approximately 46 Mbits of embedded memory, and exposes up to 600 general‑purpose I/O pins for system integration.

Designed for commercial‑grade applications, this device operates from a core supply range of 870 mV to 930 mV and across an ambient temperature range of 0 °C to 85 °C. The part is RoHS compliant and supported by the Stratix V device datasheet for electrical and switching characteristics.

Key Features

• Core Fabric  490,000 logic elements for implementing large-scale digital designs and complex programmable logic.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and large data structures without external memory.
• I/O Density  Up to 600 user I/O pins to support wide parallel interfaces and extensive board connectivity.
• High‑speed Transceiver Capability (Family)  Stratix V GX devices are documented in the family datasheet with high‑speed transceiver support; refer to the Stratix V device documentation for transceiver options and speed grades.
• Power and Supply  Core voltage supply specified from 870 mV to 930 mV to meet Stratix V operating conditions.
• Package and Mounting  1517‑BBGA (1517‑FBGA, 40×40) FCBGA surface‑mount package suited for compact board designs.
• Temperature and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑speed serial systems  Designs that leverage the Stratix V GX family transceiver capabilities for high‑bandwidth serial links (see family datasheet for transceiver speed grades).
• Large logic and memory integration  Complex FPGA designs that require high logic density and substantial embedded RAM for on‑chip data handling.
• Board‑level systems  Compact, high‑density boards where the 1517‑FBGA surface‑mount package and extensive I/O reduce external component count.

Unique Advantages

• High logic density: 490,000 logic elements enable consolidation of multiple functions into a single device, simplifying system architecture.
• Significant on‑chip RAM: Approximately 46 Mbits of embedded memory reduces reliance on external DRAM for buffering and packet staging.
• Extensive I/O count: 600 I/O pins provide flexibility for interfacing to parallel buses, peripherals, and board-level signals.
• Commercial temperature grading: Rated for 0 °C to 85 °C operation to match commercial application requirements.
• Industry compliance: RoHS compliance supports modern environmental and manufacturing requirements.
• Standardized package: 1517‑FBGA (40×40) surface‑mount package supports compact PCB layouts and consistent assembly processes.

Why Choose 5SGXEA5N1F40C1G?

The 5SGXEA5N1F40C1G places a high‑density Stratix V GX FPGA into a compact 1517‑FBGA package, combining 490,000 logic elements, approximately 46 Mbits of embedded RAM, and up to 600 I/O pins. This configuration is well suited to commercial designs that require substantial programmable logic, on‑chip memory, and board‑level connectivity within a controlled temperature range.

As a member of the Stratix V family, the device is documented in the Stratix V device datasheet for electrical, switching, and transceiver characteristics, providing the technical detail required for system design and validation.

Request a quote or submit an inquiry for pricing and availability to initiate procurement and integrate the 5SGXEA5N1F40C1G into your next design cycle.