5SGXEA5K3F40I4G

The 5SGXEA5K3F40I4G is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, offered in an FCBGA/FBGA package for surface-mount assembly. This device delivers high logic density and substantial embedded memory to support complex, high‑integration digital designs.

Key device attributes include 490,000 logic elements, approximately 46.08 Mbits of on‑chip RAM, 696 I/O pins, a low core voltage range of 820 mV to 880 mV, and an industrial operating temperature range of –40 °C to 100 °C.

Key Features

• Core capacity  490,000 logic elements to implement large-scale digital functions and complex logic networks.
• Embedded memory  Approximately 46.08 Mbits of on‑chip RAM for buffering, packet processing, and local data storage.
• High I/O count  696 I/O pins to support extensive external interfacing and multi‑lane connectivity.
• Power supply  Core voltage supply range of 820 mV to 880 mV to match low‑voltage system designs.
• Package & mounting  1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑FBGA (40×40); surface‑mount device.
• Temperature grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in extended‑environment applications.
• Regulatory compliance  RoHS compliant.

Unique Advantages

• High logic density: 490,000 logic elements enable integration of large functional blocks on a single device, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 46.08 Mbits of embedded RAM provides local storage for buffering and state retention without immediate reliance on external memory.
• Extensive external connectivity: 696 I/O pins accommodate complex interfaces and multiple peripheral channels from a single FPGA.
• Industrial temperature capability: Rated for –40 °C to 100 °C to support designs that must operate across wide temperature ranges.
• Compact, surface‑mount BGA package: 1517‑BBGA / 1517‑FBGA (40×40) packaging balances high pin count with a compact footprint for dense PCBs.
• RoHS compliant: Conforms to lead‑free manufacturing requirements for regulatory and supply‑chain needs.

Why Choose 5SGXEA5K3F40I4G?

The 5SGXEA5K3F40I4G positions itself as a high‑density Stratix V GX FPGA option for designs that require significant logic resources, large amounts of embedded RAM, and a high I/O count within a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for applications where environmental range and regulatory conformance are important.

This device is appropriate for teams seeking a single‑chip solution to consolidate logic, memory, and I/O requirements while leveraging the Stratix V GX family implementation and Intel manufacturing heritage.

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