5SGXEA5K3F40I3LG

The 5SGXEA5K3F40I3LG is a Stratix V GX FPGA IC delivering high logic density and extensive on-chip memory in a 1517-BBGA (FCBGA) package. This industrial-grade device integrates 490,000 logic elements and approximately 46 Mbits of embedded memory, providing a platform for complex digital designs that require large logic capacity and significant on-chip RAM.

With 696 I/O pins, a surface-mount 1517-FBGA (40×40) package, and an operating temperature range of −40 °C to 100 °C, the device is specified for applications that demand high interconnect count and industrial temperature resilience. The device operates from a core voltage supply range of 820 mV to 880 mV and is RoHS compliant.

Key Features

• Core and Logic Density 490,000 logic elements and 185,000 LABs provide large-scale programmable logic capacity for complex designs.
• Embedded Memory Approximately 46 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
• I/O Capacity 696 I/O pins to support high-pin-count interfaces and dense board-level connectivity.
• Package and Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for standard PCB assembly.
• Industrial Temperature Grade Rated for −40 °C to 100 °C operation for deployment in temperature-demanding environments.
• Power Supply Core voltage supply specified between 820 mV and 880 mV to enable the device’s specified electrical operation.
• Regulatory RoHS compliant.

Unique Advantages

• High logic capacity: 490,000 logic elements enable mapping of large digital functions on-chip, reducing reliance on external logic.
• Substantial on-chip RAM: Approximately 46 Mbits of embedded memory supports local storage and high-bandwidth buffering without extra memory ICs.
• Extensive I/O: 696 I/O pins allow for dense connectivity to peripherals, high-speed interfaces, and multi-channel designs.
• Industrial thermal range: −40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
• Compact BGA packaging: 1517-BBGA (1517-FBGA 40×40) provides a high I/O count in a compact surface-mount form factor for board-level integration.
• Defined core supply range: 820 mV–880 mV specification enables predictable power planning and thermal budgeting for system designers.

Why Choose 5SGXEA5K3F40I3LG?

This Stratix V GX FPGA combines large-scale logic, sizable embedded memory, and high I/O density in a single industrial-grade FCBGA package, delivering a balanced platform for complex, board-level digital systems. Its defined core voltage range and wide operating temperature window support robust deployment and predictable integration into industrial designs.

Choose the 5SGXEA5K3F40I3LG when your design requires substantial on-chip resources, extensive external connectivity, and packaging compatible with surface-mount assembly—backed by RoHS compliance and the Stratix device family datasheet specifications.

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