5SGXEA5K3F40C4N

The 5SGXEA5K3F40C4N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for surface-mount assembly. It delivers high logic capacity and substantial on-chip RAM for demanding commercial applications requiring reconfigurable logic, large I/O counts, and low-voltage core operation.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 696 user I/O pins, this device targets high-density, memory‑intensive designs while meeting commercial temperature and RoHS compliance requirements.

Key Features

• Core Logic  Approximately 490,000 logic elements provide extensive programmable fabric for complex digital designs and high-density integration.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffers, packet processing, and memory‑intensive algorithms without immediate external memory dependency.
• I/O Capability  696 available I/O pins accommodate dense external interfacing and high‑pin-count peripheral architectures.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package designed for surface-mount assembly, providing a high‑pin-count solution in a compact footprint.
• Power  Core voltage supply range of 820 mV to 880 mV for the device core power domain.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density logic systems  Use the large logic element count for complex state machines, protocol offload, and custom hardware acceleration.
• Memory‑intensive processing  On-chip RAM supports buffering and in‑FPGA data structures for packet processing, DSP chains, and stream processing.
• High‑pin-count interfacing  696 I/Os enable extensive peripheral connectivity, multi‑lane interfaces, and dense backplane or mezzanine connections.

Unique Advantages

• High programmable capacity:  Nearly half a million logic elements let you implement large, complex designs without immediate partitioning across multiple devices.
• Substantial on‑chip memory:  Approximately 46 Mbits of embedded RAM reduces reliance on external memory for many buffer and cache use cases.
• Extensive I/O integration:  696 I/Os simplify system routing and lower BOM complexity by supporting many external interfaces directly on-chip.
• Compact, high‑pin package:  The 1517‑FBGA (40×40) FCBGA package delivers high I/O density in a surface‑mount format suitable for modern PCB layouts.
• Commercial temperature and RoHS compliance:  Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments and manufacturing flows.
• Low‑voltage core operation:  Core supply range of 820–880 mV aligns with low-voltage power domains to support modern power architectures.

Why Choose 5SGXEA5K3F40C4N?

The 5SGXEA5K3F40C4N positions itself as a high-capacity, memory-rich Stratix V GX FPGA suited for commercial designs that require extensive programmable logic, significant embedded RAM, and high I/O counts. Its package and supply characteristics make it appropriate for compact, high‑density boards where surface-mount FCBGA solutions are preferred.

For teams designing complex digital systems—such as packet processing engines, large custom accelerators, or multi‑interface controllers—this device offers a balance of logic density, on‑chip memory, and robust I/O integration that supports scalable development and deployment in commercial environments.

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