5SGXEA5K3F40C3N

The 5SGXEA5K3F40C3N is a Stratix® V GX family FPGA IC from Intel, offered in a 1517-FBGA (40×40) surface-mount package. It delivers high-capacity programmable logic and embedded memory with a dense I/O footprint for complex system designs in commercial-temperature applications.

Designed for large-scale programmable designs, this device combines 490,000 logic elements with approximately 46 Mbits of on-chip RAM and 696 I/Os, while following the electrical and switching characteristics defined in the Stratix V device datasheet.

Key Features

• Core Logic Capacity — 490,000 logic elements to implement large combinational and sequential designs.
• Embedded Memory — 46,080,000 bits of total on-chip RAM (approximately 46 Mbits) for buffers, FIFOs, and local data storage.
• I/O Density — 696 total I/Os for high pin-count interfacing and board-level signal routing.
• Package and Mounting — 1517-BBGA, FCBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact, high-density layouts.
• Power and Voltage — Core voltage supply range of 820 mV to 880 mV (0.82–0.88 V) to meet device operating conditions.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial applications.
• Standards and Compliance — RoHS-compliant device.
• Series-Level Transceiver Capability — As documented in the Stratix V device datasheet, the Stratix V GX family provides transceiver speed grades (see device datasheet for specific grade capabilities and timing characteristics).

Typical Applications

• High-speed serial communications — Use the Stratix V GX family’s transceiver capabilities for board- and system-level high-speed links (refer to the device datasheet for supported speed grades).
• Large custom logic and acceleration — 490,000 logic elements and ~46 Mbits of embedded memory enable complex custom accelerators and compute offloads.
• Dense I/O aggregation — 696 I/Os support multi-protocol interfacing, wide parallel buses, and extensive sensor or I/O expansion.

Unique Advantages

• High integration density: 490,000 logic elements combine with substantial embedded RAM to reduce external components and simplify board design.
• Extensive connectivity: 696 I/Os provide flexibility for complex multi-channel and multi-interface systems.
• Compact high-pin-count package: 1517-FBGA (40×40) offers a high I/O count in a compact surface-mount form factor for space-constrained designs.
• Commercial operation range: Rated 0 °C to 85 °C to meet typical commercial-environment deployment requirements.
• Controlled core power range: Core supply 820–880 mV supports predictable power budgeting and thermal planning.
• RoHS-compliant: Conforms to RoHS requirements for environmentally conscious manufacturing.

Why Choose 5SGXEA5K3F40C3N?

The 5SGXEA5K3F40C3N is positioned for designers who need very high logic capacity, substantial on-chip RAM, and a large number of I/Os in a compact FCBGA package. Its commercial-temperature rating and RoHS compliance make it appropriate for a broad range of commercial electronic systems.

Supported by the Stratix V device documentation, this FPGA is a strong option for teams implementing complex, high-density programmable logic with significant local memory and high-speed serial capabilities at the series level. It provides a scalable platform for advanced system designs that require a balance of capacity, I/O, and package density.

If you would like pricing or availability information, request a quote or submit a pricing inquiry for the 5SGXEA5K3F40C3N today.