5SGXEA5K3F40C2N

The 5SGXEA5K3F40C2N is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA FCBGA package. It delivers very high logic capacity, substantial on-chip RAM, and a large complement of I/O for complex, high-density digital designs.

Targeted at applications that require abundant programmable logic, significant embedded memory, and wide I/O resources, this commercial-grade device balances integration and performance within a surface-mount 1517-FBGA (40×40) footprint.

Key Features

• Core Logic Capacity  490,000 logic elements to implement complex state machines, datapaths, and custom hardware blocks.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM suitable for buffering, FIFOs, and local storage.
• I/O Resources  696 I/O pins to support high-channel-count interfaces and board-level connectivity.
• Power and Voltage  Core voltage supply specified at 870 mV to 930 mV to support the device's internal power rails.
• Package and Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40); surface-mount mounting type for compact PCB integration.
• Operating Grade and Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for environmental and materials requirements.
• Stratix V GX Family  Part of the Stratix V GX family; the device series datasheet documents electrical characteristics and transceiver speed grade information.

Typical Applications

• High-density digital processing  Large logic capacity and embedded RAM make this device suitable for compute-heavy FPGA designs and custom hardware acceleration.
• High-channel I/O systems  The 696 I/Os support multi-lane board interfaces, sensor arrays, and complex peripheral connectivity.
• Communications and networking  As a Stratix V GX family device, it aligns with designs that leverage the family’s documented transceiver capabilities for high-speed serial links (see device datasheet for details).

Unique Advantages

• Substantial logic headroom: 490,000 logic elements provide capacity to consolidate multiple functions into a single device, reducing board-level complexity.
• Ample on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• Extensive I/O availability: 696 I/Os enable broad connectivity without immediate need for external IO expanders.
• Compact, production-ready package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports high-density PCB assemblies and modern manufacturing flows.
• Commercial temperature suitability: Rated 0 °C to 85 °C for applications targeting commercial environments and product classes.
• Regulatory compliance: RoHS compliance assists in meeting environmental materials requirements for manufactured products.

Why Choose 5SGXEA5K3F40C2N?

The 5SGXEA5K3F40C2N combines very high logic density, significant embedded memory, and a large I/O complement in a compact FCBGA package—attributes that help minimize system BOM and simplify board-level design. As a member of the Intel Stratix V GX family, the device is documented within the family datasheet for electrical characteristics and transceiver-grade information, enabling informed design decisions.

This device is well suited for engineers and teams building complex FPGA-based systems that require on-chip resources and broad connectivity within a commercial temperature envelope. Its package, power requirements, and compliance profile support production-oriented PCB integration and supply-chain considerations.

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