5SGXEA5K3F40C2LG

The 5SGXEA5K3F40C2LG is a Stratix V GX field-programmable gate array (FPGA) from Intel. It delivers very high logic capacity and extensive I/O in a 1517-ball FCBGA package for surface-mount applications.

Designed for designs that require large on-chip memory and dense logic, this commercial-grade device integrates approximately 46.08 Mbits of embedded memory, roughly 490,000 logic elements distributed across 185,000 logic blocks, and 696 I/O pins, providing the raw resources needed for complex digital and transceiver-enabled systems.

Key Features

• Core Logic Capacity  Approximately 490,000 logic elements organized across 185,000 logic blocks to support large, parallelizable designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and local storage to minimize external memory dependence.
• I/O Density  696 I/Os to support wide buses, multiple peripherals, and extensive board-level connectivity.
• Transceiver-Class Device  Stratix V GX family devices include high-speed transceiver capabilities (as specified for the GX series in the device datasheet), enabling multi-gigabit serial interfaces where required.
• Power  Core voltage supply specified at 820 mV to 880 mV to meet device operating requirements.
• Package and Mounting  1517-BBGA FCBGA package (1517-FBGA, 40×40) for high-density board-level integration; surface-mount mounting type.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to suit commercial-environment applications.
• RoHS Compliant  Device meets RoHS requirements for restricted substances.

Typical Applications

• High-density logic systems  Implement large-scale combinational and sequential logic blocks where significant LUT/logic capacity is required.
• Multi-channel serial and transceiver-based designs  Use the GX-class transceiver capabilities (per the Stratix V GX series specification) for multi-gigabit serial links and high-speed data transport.
• On-chip buffering and packet processing  Leverage approximately 46.08 Mbits of embedded memory for packet buffers, FIFOs, and localized data storage to reduce external memory bandwidth needs.
• High I/O-count interface hubs  Support designs that require hundreds of I/Os for parallel interfaces, multi-port connectivity, or broad sensor/actor interfacing.

Unique Advantages

• Substantial logic resources: Nearly half a million logic elements enable complex algorithms, parallel processing lanes, and high-density implementations without immediate recourse to multiple devices.
• Significant on-chip memory: Approximately 46.08 Mbits of embedded RAM allows large local buffers and reduces dependence on external DRAM for many use cases.
• High I/O scalability: 696 I/Os provide the flexibility to connect multiple high-pin-count peripherals or wide parallel buses directly to the FPGA.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant to align with standard commercial product requirements and environmental regulations.
• Compact high-density package: The 1517-ball FCBGA (40×40) package offers a compact footprint for dense board designs while maintaining high I/O and signal integrity potential.

Why Choose 5SGXEA5K3F40C2LG?

The 5SGXEA5K3F40C2LG combines large logic capacity, substantial embedded memory, and very high I/O count in a commercial-grade Stratix V GX FPGA package. It is well suited to complex digital systems that need on-chip resources for heavy local processing, broad connectivity, and transceiver-capable interfaces as documented for the Stratix V GX family.

As an Intel Stratix V GX device, it is specified with clear electrical and operating parameters (including core voltage range and temperature rating) to support predictable integration into commercial designs that demand scalability and high resource density.

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