5SGXEA5K3F40I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,332 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5K3F40I3N – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, 1517-BBGA FCBGA
The 5SGXEA5K3F40I3N is a Stratix® V GX family FPGA offered in an industrial temperature grade. It delivers high-density programmable logic, abundant embedded memory, and a large I/O count in a 1517-BBGA (FCBGA) package for surface-mount applications.
Targeted at designs that require significant on-chip resources and robust thermal range, this device is suitable for complex digital processing and systems that rely on extensive I/O and embedded memory capacity.
Key Features
- High-density logic Approximately 490,000 logic elements enabling large-scale programmable designs and complex system integration.
- Embedded memory Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
- I/O and package 696 user I/Os in a 1517-BBGA (FCBGA) package; supplier device package indicated as 1517-FBGA (40×40). Surface-mount mounting type.
- Industrial temperature grade Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Low-voltage core Core supply range of 820 mV to 880 mV for the device core voltage domain.
- Compliance RoHS compliant for global environmental and manufacturing standards.
- Stratix V GX family characteristics Part of the Stratix V GX device family; device-level electrical and transceiver switching characteristics are described in the Stratix V device datasheet, including available commercial and industrial speed grades.
Typical Applications
- Large-scale digital processing Use the high logic element count and on-chip RAM for complex algorithms, datapath implementations, and multi-function systems.
- High-density I/O systems Leverage 696 I/Os and the 1517-BBGA package for designs requiring extensive external device interfacing and board-level connectivity.
- Memory-centric buffering Approximately 46 Mbits of embedded memory supports packet buffering, FIFOs, and local storage for latency-sensitive applications.
- Industrial applications Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for deployments in harsh or wide-temperature environments.
Unique Advantages
- High integration density: Condenses large logic capacity and memory on a single FPGA device to reduce BOM and board area.
- Extensive I/O availability: 696 I/Os provide flexibility for complex I/O topologies and multi-channel interfaces without external multiplexing.
- Robust thermal range: Industrial operating temperature supports reliable operation across a wide set of environmental conditions.
- Compact surface-mount package: 1517-BBGA FCBGA packaging balances pin count and footprint for high-density board designs.
- Controlled core voltage: 820 mV–880 mV supply range supports device power-domain planning and integration with regulated power systems.
- Standards-aligned manufacturing: RoHS compliance for environmentally conscious production and global supply chain requirements.
Why Choose 5SGXEA5K3F40I3N?
The 5SGXEA5K3F40I3N provides a combination of very large logic capacity, substantial on-chip memory, and a high I/O count within an industrial-grade Stratix V GX FPGA package. Its specifications make it well suited for designs that demand integration of complex logic, significant buffering, and broad external connectivity while maintaining functionality across a wide temperature range.
This device is appropriate for engineering teams developing high-density, performance-oriented FPGA systems that require predictable electrical characteristics and a compact surface-mount package with a large pin count.
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