5SGXEA5K3F40I3N

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 46080000 490000 1517-BBGA, FCBGA

Quantity 1,332 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5K3F40I3N – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, 1517-BBGA FCBGA

The 5SGXEA5K3F40I3N is a Stratix® V GX family FPGA offered in an industrial temperature grade. It delivers high-density programmable logic, abundant embedded memory, and a large I/O count in a 1517-BBGA (FCBGA) package for surface-mount applications.

Targeted at designs that require significant on-chip resources and robust thermal range, this device is suitable for complex digital processing and systems that rely on extensive I/O and embedded memory capacity.

Key Features

  • High-density logic  Approximately 490,000 logic elements enabling large-scale programmable designs and complex system integration.
  • Embedded memory  Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
  • I/O and package  696 user I/Os in a 1517-BBGA (FCBGA) package; supplier device package indicated as 1517-FBGA (40×40). Surface-mount mounting type.
  • Industrial temperature grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Low-voltage core  Core supply range of 820 mV to 880 mV for the device core voltage domain.
  • Compliance  RoHS compliant for global environmental and manufacturing standards.
  • Stratix V GX family characteristics  Part of the Stratix V GX device family; device-level electrical and transceiver switching characteristics are described in the Stratix V device datasheet, including available commercial and industrial speed grades.

Typical Applications

  • Large-scale digital processing  Use the high logic element count and on-chip RAM for complex algorithms, datapath implementations, and multi-function systems.
  • High-density I/O systems  Leverage 696 I/Os and the 1517-BBGA package for designs requiring extensive external device interfacing and board-level connectivity.
  • Memory-centric buffering  Approximately 46 Mbits of embedded memory supports packet buffering, FIFOs, and local storage for latency-sensitive applications.
  • Industrial applications  Industrial temperature rating (−40 °C to 100 °C) makes the device suitable for deployments in harsh or wide-temperature environments.

Unique Advantages

  • High integration density: Condenses large logic capacity and memory on a single FPGA device to reduce BOM and board area.
  • Extensive I/O availability: 696 I/Os provide flexibility for complex I/O topologies and multi-channel interfaces without external multiplexing.
  • Robust thermal range: Industrial operating temperature supports reliable operation across a wide set of environmental conditions.
  • Compact surface-mount package: 1517-BBGA FCBGA packaging balances pin count and footprint for high-density board designs.
  • Controlled core voltage: 820 mV–880 mV supply range supports device power-domain planning and integration with regulated power systems.
  • Standards-aligned manufacturing: RoHS compliance for environmentally conscious production and global supply chain requirements.

Why Choose 5SGXEA5K3F40I3N?

The 5SGXEA5K3F40I3N provides a combination of very large logic capacity, substantial on-chip memory, and a high I/O count within an industrial-grade Stratix V GX FPGA package. Its specifications make it well suited for designs that demand integration of complex logic, significant buffering, and broad external connectivity while maintaining functionality across a wide temperature range.

This device is appropriate for engineering teams developing high-density, performance-oriented FPGA systems that require predictable electrical characteristics and a compact surface-mount package with a large pin count.

Request a quote or submit a pricing inquiry to receive availability and procurement information for part number 5SGXEA5K3F40I3N.

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