5SGXEA5N1F45C1N

The 5SGXEA5N1F45C1N is a high-density Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1932‑ball BGA (FCBGA) package. It delivers a large logic fabric and substantial on‑chip RAM along with extensive I/O capability for demanding commercial designs.

With approximately 490,000 logic elements, about 46.08 Mbits of embedded memory, and up to 840 I/O, this device targets systems that require dense programmable logic, significant embedded memory, and high pin‑count interfacing while operating within a commercial temperature range.

Key Features

• Core Logic  Approximately 490,000 logic elements to implement complex digital functions and large-scale logic designs.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support buffering, state storage, and data processing close to logic.
• I/O Capacity  Up to 840 I/O to support high‑pin‑count interfaces and flexible board connectivity.
• Package & Mounting  1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45×45); designed for surface‑mount assembly.
• Power Supply  Core voltage supply range of 870 mV to 930 mV for the device core rails.
• Operating Range  Commercial grade device rated for operation from -40 °C to 100 °C.
• Compliance  RoHS compliant.
• Documentation  Part of the Stratix V GX family with device electrical and switching characteristics described in the Stratix V device datasheet.

Typical Applications

• High‑density digital processing  Designs that require extensive programmable logic capacity and embedded memory for complex algorithms and data manipulation.
• High‑pin‑count interface systems  Applications that need numerous I/O lines for parallel interfaces, multi‑lane connectivity, or dense board routing.
• Commercial‑grade embedded systems  Products and prototypes intended for commercial environments operating within a -40 °C to 100 °C range.

Unique Advantages

• Highly integrated logic and memory: Combines roughly 490,000 logic elements with ~46.08 Mbits of embedded RAM to reduce external component count and board complexity.
• Large I/O complement: Up to 840 I/O pins provide flexibility for complex interconnect and multi‑interface designs.
• Compact, manufacturable package: 1932‑BBGA (FCBGA) surface‑mount package supports high‑density PCB layouts and standard assembly processes.
• Tightly defined core supply: Core supply range of 870 mV–930 mV helps designers provision proper power regulation for stable operation.
• Commercial temperature suitability: Rated for -40 °C to 100 °C, enabling deployment in a wide range of commercial applications.
• RoHS compliance: Meets environmental regulations for lead‑free manufacturing and assembly.

Why Choose 5SGXEA5N1F45C1N?

The 5SGXEA5N1F45C1N positions itself as a high‑density Stratix V GX FPGA option for commercial designs that need extensive logic resources, sizable embedded memory, and a large I/O complement within a compact BGA footprint. Its defined core voltage window and broad operating temperature range make it suitable for robust commercial systems where integration and board‑level consolidation matter.

Engineers developing complex digital processing, multi‑interface boards, or memory‑intensive algorithms will find the device’s resource set and package attributes aligned with high‑performance, high‑integration designs. Supportive device documentation for the Stratix V family provides the electrical and switching characteristics needed for system‑level planning and integration.

Request a quote or submit an inquiry for part number 5SGXEA5N1F45C1N to evaluate suitability for your next high‑density FPGA design.