5SGXEA5N1F45C2LN

The 5SGXEA5N1F45C2LN is a Stratix V GX fieldprogrammable gate array (FPGA) IC from Intel, offered in a 1932-ball FCBGA package. It provides a high-density programmable fabric and on-chip memory for complex digital designs that require large logic capacity and extensive I/O.

Designed for commercial-temperature applications, this device targets designs that demand a combination of high logic element count, substantial embedded RAM, and broad I/O connectivity while operating from a low-voltage core supply.

Key Features

• Logic Capacity  Approximately 490,000 logic elements, enabling large-scale integration of custom digital functions on a single device.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, packet processing, and data-heavy algorithms without immediate dependence on external memory.
• I/O Density  840 user I/Os to accommodate complex board-level interfacing and multi-channel connectivity.
• Transceiver and Timing (Device Family)  Stratix V GX family documentation includes transceiver speed grade options (family-level information includes GX channel speeds reported in device documentation), supporting high-speed serial connectivity as specified in the Stratix V device datasheet.
• Power  Core voltage supply range: 820 mV to 880 mV, allowing low-voltage core operation consistent with the Stratix V device requirements.
• Package and Mounting  1932-ball BGA (1932-BBGA, FCBGA); supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for standard PCB assembly.
• Operating Range  Commercial grade operation rated from 0 °C to 85 °C for typical commercial-environment deployments.
• RoHS Compliance  Device is RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• High-density custom digital processing  Complex algorithms and state machines that require up to 490,000 logic elements and substantial embedded RAM.
• High-throughput communications  Designs leveraging Stratix V GX transceiver options documented for high-speed serial channels as part of the device family.
• Large I/O systems  Multi-channel data acquisition, control systems, or board-level subsystems that need up to 840 I/Os for sensors, peripherals, and external interfaces.

Unique Advantages

• High logic density: Combines approximately 490,000 logic elements to consolidate complex digital functions onto a single FPGA.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on external memory for many buffering and data-processing tasks.
• Extensive I/O count: 840 I/Os support rich connectivity options for multi-channel and multi-peripheral designs.
• Compact FCBGA package: 1932-ball FCBGA footprint delivers the device density required for space-constrained, high-performance PCBs.
• Low-voltage core operation: 820 mV–880 mV core supply range aligns with the Stratix V device family’s power architecture.
• Commercial temperature rating: Rated 0 °C to 85 °C for designs targeting commercial environments.

Why Choose 5SGXEA5N1F45C2LN?

The 5SGXEA5N1F45C2LN positions itself as a high-density Stratix V GX FPGA option for commercial applications that require a large number of logic elements, substantial on-chip memory, and a high I/O count in a single surface-mount FCBGA package. Its specification set—490,000 logic elements, approximately 46 Mbits of embedded RAM, 840 I/Os, and a low-voltage core supply—makes it suitable for complex digital designs and high-throughput systems.

Backed by Intel’s Stratix V device documentation, this FPGA is appropriate for engineers and teams looking to scale logic and memory resources in commercial-temperature designs while leveraging a documented family of transceiver and timing options.

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