5SGXEA5N1F45C2N

The 5SGXEA5N1F45C2N is a Stratix® V GX field-programmable gate array (FPGA) manufactured by Intel. This commercial-grade device delivers very large logic capacity, substantial on-chip memory, and broad I/O in a high-density FCBGA package.

Key use cases include complex digital designs that require extensive logic resources, significant embedded memory, and large I/O counts. The device’s documented electrical characteristics and commercial temperature rating make it suitable for mainstream embedded and networking applications within the specified operating conditions.

Key Features

• Core Logic  Approximately 490,000 logic elements (logic cells) to implement large, partitioned FPGA designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for data buffering, FIFOs, and on-chip storage.
• I/O Capacity  840 available I/O pins to support multi-channel interfaces and high-density board-level connectivity.
• Power Supply  Core voltage supply range of 870 mV to 930 mV as specified for device operation.
• Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45); surface-mount device for compact PCB integration.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Documentation  Stratix V device electrical and switching characteristics are documented in the device datasheet for design reference.

Typical Applications

• High-density digital processing  Large logic element count supports complex custom logic, datapath processing, and algorithm acceleration.
• Memory-intensive designs  Approximately 46 Mbits of embedded RAM enables buffering, packet storage, and on-chip data management.
• Multi-channel interface systems  840 I/O pins facilitate designs with numerous parallel interfaces, board-level peripherals, and high pin-count connectivity.

Unique Advantages

• Extensive logic resources: The device’s ~490k logic elements let you implement large-scale, multi-module FPGA designs without immediate migration.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces external memory dependence for many buffering and storage needs.
• Wide I/O breadth: 840 I/O pins provide flexibility for complex front-end interfaces and dense board-level interconnects.
• Compact, manufacturable package: 1932-BBGA FCBGA in a 45×45 footprint enables high-density PCB layouts with surface-mount assembly.
• Documented operating conditions: Electrical and switching characteristics for the Stratix V family are published in the device datasheet to support design validation.
• Regulatory compliance: RoHS compliance addresses environmental material requirements.

Why Choose 5SGXEA5N1F45C2N?

This Stratix V GX FPGA combines very large logic capacity, substantial embedded memory, and broad I/O in a single commercial-grade FCBGA package, making it well suited for complex embedded, networking, and high-channel-count designs that fit the device’s electrical and temperature specifications. The device is supplied by Intel and is accompanied by Stratix V device documentation covering electrical and switching characteristics to support system-level design and validation.

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