5SGXEA5N2F40C1N

The 5SGXEA5N2F40C1N is a Stratix V GX FPGA from Intel, delivering very high programmable logic capacity and substantial on-chip memory for complex digital designs. It is a commercial-grade, surface-mount FPGA packaged in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package and is intended for applications that require large logic arrays and extensive I/O.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 600 I/Os, this device targets high-density, high-interconnect designs where integration and on-chip buffering matter. The device operates from a core supply range of 870 mV to 930 mV and is rated for 0 °C to 85 °C commercial operation.

Key Features

• High Logic Density  490,000 logic elements provide extensive programmable logic resources for complex designs and large-scale integration.
• On-chip Memory  Approximately 46.08 Mbits of embedded RAM for data buffering, frame storage, and intermediate processing without relying on external memory.
• Extensive I/O  600 I/O pins to support broad peripheral connectivity, multi-channel interfaces, and dense system interconnects.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package, surface-mount for compact board-level integration.
• Voltage Supply  Core operating range of 870 mV to 930 mV to match system power architectures that use low-voltage FPGA cores.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial deployments.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High-density logic systems: Use the large logic element count and embedded RAM for complex control, algorithm acceleration, and large-scale state machines.
• Multi-interface hubs and protocol bridging: 600 I/Os enable aggregation and protocol translation across many channels and interfaces.
• Network and communications equipment: On-chip memory and logic capacity support packet processing, buffering, and custom protocol handling.
• Imaging and signal processing: Substantial embedded RAM and logic resources allow for frame buffering, pipeline processing, and custom data-flow architectures.

Unique Advantages

• Large programmable capacity: 490,000 logic elements give headroom for extensive feature integration and future design growth.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependency on external memory for many buffering and processing tasks.
• High I/O count: 600 I/Os provide flexibility to connect multiple peripherals, high-pin-count interfaces, and parallel data streams without complex multiplexing.
• Compact FCBGA footprint: 1517-FBGA (40×40) package enables dense board layouts while maintaining thermal and electrical performance for surface-mount assembly.
• Low-voltage core operation: Narrow core supply window (870 mV–930 mV) suitable for systems designed around low-voltage FPGA cores.
• Commercial temperature rating and RoHS compliance: Ready for commercial deployments with environmental compliance for many global markets.

Why Choose 5SGXEA5N2F40C1N?

The 5SGXEA5N2F40C1N combines very high logic density, substantial embedded memory, and an extensive I/O count in a compact FCBGA package to address demanding, I/O‑intensive designs. As a commercial-grade Stratix V GX device from Intel, it is suited to system designers who need on-chip capacity for buffering and compute while keeping board-level integration compact.

This FPGA is a solid option for engineering teams building scalable, high-function designs that require large programmable resources and significant on-chip RAM. Its specifications support integration of complex data paths and multi-channel interfaces while complying with RoHS requirements.

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