5SGXEA5N1F45I2N

The 5SGXEA5N1F45I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, industrial-grade applications. It delivers a large programmable fabric with 490,000 logic elements and approximately 46.08 Mbits of embedded memory, plus 840 I/O pins for complex system integration.

With an industrial operating temperature range and a low-voltage core supply window (870 mV to 930 mV), this device is suited to designs that require high integration, significant on-chip memory, and broad I/O capacity in a surface-mount 1932-BBGA (FCBGA) package.

Key Features

• Core Architecture Stratix V GX FPGA family device architecture as indicated in the Stratix V device documentation.
• Logic Capacity 490,000 logic elements for implementing large-scale programmable logic and control functions.
• Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without relying on external memory.
• I/O Density 840 user I/Os to interface with numerous peripherals, sensors, and high-pin-count subsystems.
• Power and Voltage Core supply voltage range of 870 mV to 930 mV for the device core rails.
• Package and Mounting 1932‑BBGA (FCBGA) surface-mount package; supplier device package listed as 1932‑FBGA, FC (45×45).
• Temperature and Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems — Use the industrial temperature rating and extensive I/O to implement control, monitoring, and real-time logic in factory and process environments.
• Communications and Networking — Leverage the high logic element count and substantial on-chip memory to implement packet processing, protocol handling, and buffering functions.
• Measurement and Test Equipment — High I/O density and large programmable fabric support data acquisition, signal conditioning, and real-time processing tasks.

Unique Advantages

• High integration density: 490,000 logic elements and ~46.08 Mbits of embedded RAM enable complex functions to be implemented on a single device.
• Extensive I/O resources: 840 I/Os provide flexibility for interfacing to multiple subsystems, sensors, and external devices without extensive I/O expansion.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployments in demanding environmental conditions.
• Compact footprint: 1932‑BBGA (FCBGA) surface-mount package with a 45×45 supplier package dimension supports high-density board designs.
• Standards-conscious manufacturing: RoHS compliance supports regulatory and environmental expectations for electronic assemblies.

Why Choose 5SGXEA5N1F45I2N?

The 5SGXEA5N1F45I2N positions itself for designs that require substantial programmable logic, generous on-chip memory, and large I/O capacity within an industrial temperature envelope. Its Stratix V GX family heritage and the published device documentation provide the electrical and switching characteristic references engineers need for system-level design and verification.

This device is suited to engineering teams developing industrial controls, communications equipment, and advanced test systems that benefit from high integration, deterministic on-chip resources, and a compact BGA footprint.

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