5SGXEB5R2F40C3N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 234 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level2A (4 Weeks)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R2F40C3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

The 5SGXEB5R2F40C3N is a commercial-grade Stratix® V GX field programmable gate array supplied in a 1517-FBGA (40×40) surface-mount package. It delivers high logic capacity and substantial on-chip memory for complex digital designs.

With 490,000 logic elements, approximately 41.984 Mbits of embedded RAM, and 432 I/O pins, this device is suited to high-density logic integration where significant programmable logic, memory and connectivity are required. The device operates from a core supply range of 870 mV to 930 mV and supports an operating temperature range of 0 °C to 85 °C. RoHS compliance is indicated.

Key Features

  • Core Logic — 490,000 logic elements provide capacity for large, complex FPGA implementations.
  • Configurable Logic Blocks — 185,000 configurable logic blocks to structure and partition designs effectively.
  • Embedded Memory — Total on-chip RAM of approximately 41.984 Mbits to support data buffering, state machines and embedded tables.
  • I/O Count — 432 I/O pins for broad external device interfacing and parallel connectivity.
  • Package & Mounting — 1517-FBGA (40×40) in a surface-mount package for compact board-level integration.
  • Power Supply — Core voltage supply range 870 mV to 930 mV to support targeted power architectures.
  • Operating Temperature — Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Networking & Telecommunications — Implement protocol processing, packet buffering and custom data-path logic using the device’s high logic and memory resources.
  • High-performance Data Processing — Accelerate algorithmic and data-flow tasks that require large programmable fabric and significant on-chip RAM.
  • Signal Processing & Communications — Deploy custom DSP pipelines and interface logic where dense logic and many I/Os simplify board-level design.
  • Prototyping & System Integration — Use the device for board- and system-level prototyping of complex digital functions before production implementation.

Unique Advantages

  • High Logic Capacity: 490,000 logic elements let you implement complex state machines, custom processors and wide data paths on a single device.
  • Substantial On-chip Memory: Approximately 41.984 Mbits of embedded RAM reduces dependence on external memory for many buffering and table-driven functions.
  • Extensive I/O: 432 I/Os provide flexibility for parallel interfaces, multi-channel connectivity and mixed-signal front-ends.
  • Compact BGA Packaging: 1517-FBGA (40×40) surface-mount package supports high-density PCB layouts while maintaining robust soldered connections.
  • Commercial-grade Operating Range: 0 °C to 85 °C makes the device appropriate for standard commercial applications and environments.
  • Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose 5SGXEB5R2F40C3N?

The 5SGXEB5R2F40C3N positions itself as a high-capacity, commercially graded Stratix® V GX FPGA targeted at designs that demand large programmable logic resources, significant embedded memory and broad I/O connectivity in a compact surface-mount package. Its combination of logic density, on-chip RAM and 1517-FBGA packaging makes it well suited to developers and system integrators building complex digital subsystems and data-path accelerators.

Choose this device when your design requires substantial on-chip resources for integration and scalability while maintaining a standard commercial operating profile and RoHS compliance. The device is appropriate for teams focused on board-level FPGA integration, prototyping and deployment in commercial electronic systems.

Request a quote or submit a part inquiry to receive pricing and availability information for 5SGXEB5R2F40C3N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up