5SGXEB5R2F40C2N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 361 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R2F40C2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEB5R2F40C2N is a Stratix V GX series FPGA offered in a 1517‑FBGA (40×40) package. It provides a high logic capacity and substantial on‑chip memory to support complex, programmable digital designs.

Designed as a commercial‑grade device, this FPGA combines a large number of logic elements, abundant embedded RAM, high I/O count, and support for Stratix V GX transceiver speed grades to address demanding board‑level programmable logic and high‑speed connectivity requirements.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements to implement large combinational and sequential designs.
  • Embedded Memory  Approximately 42 Mbits of on‑chip RAM for buffering, FIFOs, and embedded data storage.
  • I/O Density  432 user I/O pins to support extensive peripheral and interface connectivity on a single device.
  • Transceiver Support (Series)  Stratix V GX series transceiver speed grades are documented up to 14.1 Gbps, enabling multi‑gigabit serial links where required by the design (series capability as documented in the Stratix V device datasheet).
  • Power Supply  Core voltage supply range from 870 mV to 930 mV, enabling predictable power domain planning on your board.
  • Package & Mounting  1517‑FBGA (40×40) package with surface‑mount mounting for compact PCB integration.
  • Operating Environment  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant to meet environmental and regulatory requirements for lead‑free assembly.

Typical Applications

  • High‑density digital processing  Leverage the device’s ~490k logic elements and ~42 Mbits of embedded memory for complex signal processing, protocol stacks, or custom accelerators.
  • Multi‑Gbps serial connectivity  Use in systems that require Stratix V GX series transceiver performance for high‑speed serial links (series transceiver grades documented up to 14.1 Gbps).
  • Board‑level system integration  High I/O count (432 pins) allows consolidation of multiple interfaces and peripherals on a single FPGA for compact system designs.

Unique Advantages

  • High logic density: Approximately 490,000 logic elements reduce the need for multiple devices and simplify system partitioning.
  • Significant on‑chip RAM: Approximately 42 Mbits of embedded memory supports large buffering and local storage without external memory for many use cases.
  • Extensive I/O: 432 I/O pins enable flexible connectivity and simplify board routing for complex systems.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C to meet mainstream commercial‑grade application environments.
  • Compact, surface‑mount package: 1517‑FBGA (40×40) footprint facilitates high‑density PCB layouts and automated assembly.
  • RoHS compliance: Conforms to lead‑free requirements for modern manufacturing processes.

Why Choose 5SGXEB5R2F40C2N?

The 5SGXEB5R2F40C2N delivers a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a compact 1517‑FBGA package. As a commercial‑grade Stratix V GX device, it is suited for designers who need programmable logic with strong on‑chip resources and series‑documented transceiver capabilities.

This device is appropriate for teams building complex digital systems that require consolidated logic, local memory storage, and flexible I/O, while maintaining compliance with RoHS and standard commercial operating conditions. Its specifications support scalable designs where integration and predictable electrical requirements (core voltage and temperature range) are key.

Request a quote or submit a pricing inquiry to evaluate 5SGXEB5R2F40C2N for your next design. Include your quantity and required delivery timeline for a tailored response.

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