5SGXMA5K2F40C2WN

The 5SGXMA5K2F40C2WN is an Intel Stratix V GX field programmable gate array delivering very large logic capacity and on‑chip memory in a 1517‑ball FCBGA surface‑mount package. The device combines 490,000 logic elements with approximately 46.1 Mbits of embedded RAM and 696 I/Os to support complex, high‑resource FPGA designs.

Designed for commercial temperature operation (0 °C to 85 °C) and RoHS compliant, this part targets applications that require substantial programmable logic, dense I/O, and a compact BGA footprint. The device core operates in the 870 mV to 930 mV range.

Key Features

• High Logic Capacity  490,000 logic elements to implement large FPGA designs and complex custom logic functions.
• Embedded Memory  Approximately 46.1 Mbits of on‑chip RAM for data buffering, lookup tables, and localized storage.
• I/O Density  696 I/Os for broad external interfacing and multi‑channel connectivity within a single device.
• Core Voltage  Voltage supply range of 870 mV to 930 mV to match low‑voltage core power domains.
• Package and Mounting  1517‑BBGA (1517‑FBGA, 40×40) FCBGA, surface‑mount package for high‑density board integration.
• Commercial Grade  Rated for 0 °C to 85 °C operating temperature range suitable for commercial applications.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑capacity FPGA designs  Implement large‑scale logic functions and custom accelerators taking advantage of 490,000 logic elements and abundant on‑chip RAM.
• Multi‑I/O systems  Support complex board‑level interfaces and parallel channel connectivity using 696 available I/Os.
• Embedded data buffering  Leverage approximately 46.1 Mbits of embedded RAM for local buffering, FIFOs, and high‑throughput data staging.

Unique Advantages

• Large integrated resources: High logic element count and substantial embedded memory reduce the need for external logic and RAM components.
• High I/O capacity: 696 I/Os enable dense interfacing and consolidation of multiple functions into one FPGA, simplifying board design.
• Compact, manufacturable package: 1517‑BBGA FCBGA surface‑mount package supports high‑density PCB layouts and automated assembly.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to meet commercial production requirements.
• Low‑voltage core operation: Core supply range of 870–930 mV aligns with modern low‑voltage power architectures.

Why Choose 5SGXMA5K2F40C2WN?

The 5SGXMA5K2F40C2WN provides a high‑capacity Stratix V GX FPGA solution for designs that require extensive programmable logic, significant on‑chip memory, and large I/O counts in a single package. Its 1517‑ball FCBGA package and surface‑mount form factor allow integration into compact, production boards while meeting commercial temperature requirements.

This device is suitable for engineering teams and programs that need to consolidate complex logic and buffering into a single FPGA, maintain a low core voltage domain, and comply with RoHS requirements. Choosing this Intel Stratix V GX part helps streamline system integration where logic density, embedded memory, and I/O capacity are primary design drivers.

Request a quote or submit an inquiry for pricing and availability for the 5SGXMA5K2F40C2WN to evaluate this device for your next design.