5SGXMA5N2F40C3G

The 5SGXMA5N2F40C3G is a Stratix V GX field-programmable gate array (FPGA) from Intel, designed for high-density logic and embedded memory applications. As a Stratix V GX device, it offers the architectural capabilities of the Stratix V family in a high-pin-count FCBGA package suitable for complex, board-level FPGA implementations.

Key attributes include 490,000 logic elements, approximately 46 Mbits of embedded RAM, up to 600 user I/O pins, and a commercial operating range. The device targets designs that require large logic capacity, significant on-chip memory, and extensive I/O connectivity.

Key Features

• Core Capacity — 490,000 logic elements to implement large, complex digital designs and custom logic networks.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and large lookup tables without external memory.
• I/O Density — Up to 600 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count designs.
• Transceiver Family (Series-Level) — Part of the Stratix V GX family, which provides GX transceiver options as defined for the Stratix V series.
• Power and Voltage — Core voltage supply specified from 820 mV to 880 mV to match system power-rail planning.
• Package and Mounting — 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for dense board integration.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS-compliant device to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing — Implement large custom datapaths, control logic, and algorithm accelerators using the device’s 490,000 logic elements and substantial on-chip memory.
• Multi-gigabit transceiver systems — Use within designs that leverage the Stratix V GX transceiver family characteristics for high-speed serial links (series-level capability).
• High-pin-count interface hubs — Support for up to 600 I/O pins enables aggregation of multiple parallel buses, sensor arrays, or peripheral interfaces on a single FPGA.
• Commercial embedded systems — Deploy in temperature-controlled, commercial-grade products that require large logic and memory resources on a single programmable device.

Unique Advantages

• Large logic fabric: 490,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM enables substantial buffering and data manipulation without immediate reliance on external memory.
• Extensive I/O: 600 user I/O pins let designers interface broadly with parallel sensors, buses, and peripherals while maintaining a single-chip solution.
• Compact FCBGA package: The 1517-BBGA (1517-FBGA 40×40) surface-mount package delivers high integration density for space-constrained PCBs.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance to align with common manufacturing and deployment requirements.
• Low-voltage core operation: Defined core supply range (820–880 mV) helps with predictable power budgeting and power-rail design.

Why Choose 5SGXMA5N2F40C3G?

The 5SGXMA5N2F40C3G positions itself as a high-capacity, commercial-grade Stratix V GX FPGA optimized for designs that require massive logic resources, substantial embedded RAM, and broad I/O. Its FCBGA package and surface-mount form factor make it suitable for dense, board-level implementations where consolidating functionality into a single programmable device reduces system complexity.

With explicit electrical and packaging specifications—including core voltage range, operating temperature window, and RoHS compliance—this part offers a clear, verifiable foundation for engineering teams evaluating large-scale FPGA solutions in commercial products.

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